Anbieter: Anybook.com, Lincoln, Vereinigtes Königreich
EUR 2,98
Anzahl: 1 verfügbar
In den WarenkorbZustand: Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In fair condition, suitable as a study copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,600grams, ISBN:9780412617300.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 59,97
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Anbieter: Books Puddle, New York, NY, USA
Zustand: New. pp. 324.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 79,02
Anzahl: 2 verfügbar
In den WarenkorbPaperback. Zustand: Brand New. 324 pages. 9.61x6.69x0.68 inches. In Stock.
Anbieter: moluna, Greven, Deutschland
EUR 48,37
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New.
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.
Anbieter: preigu, Osnabrück, Deutschland
Taschenbuch. Zustand: Neu. Technology CAD Systems | Franz Fasching (u. a.) | Taschenbuch | viii | Englisch | 2012 | Springer | EAN 9783709193174 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Anbieter: Mispah books, Redhill, SURRE, Vereinigtes Königreich
EUR 109,40
Anzahl: 1 verfügbar
In den WarenkorbPaperback. Zustand: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Anbieter: Mispah books, Redhill, SURRE, Vereinigtes Königreich
EUR 166,48
Anzahl: 1 verfügbar
In den WarenkorbHardcover. Zustand: Very Good. Dust Jacket may NOT BE INCLUDED.CDs may be missing. SHIPS FROM MULTIPLE LOCATIONS. book.
Sprache: Englisch
Verlag: New York, NY, U.S.A.: Chapman & Hall, 1995, 1994
ISBN 10: 0412617307 ISBN 13: 9780412617300
Anbieter: White Raven Books, Ypsilanti, MI, USA
Hardcover. Zustand: Near Fine. 6"x9.5". Shiny yellow paper over boards; an almost fine ex library copy with no dust jacket; "This book presents a state-of-the-art review of feature techniques in CAD/CAM.The key feature modelling issues addressed are: organization, management, representation, recognition, and validation.".
Anbieter: GreatBookPrices, Columbia, MD, USA
EUR 234,11
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: As New. Unread book in perfect condition.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 223,08
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes Königreich
EUR 223,07
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New.
Anbieter: GreatBookPrices, Columbia, MD, USA
EUR 241,85
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New.
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes Königreich
EUR 238,54
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: As New. Unread book in perfect condition.
Buch. Zustand: Neu. Neuware - This book provides up-to-date information about the promising use of feature technology for integrating computer-aided-design with subsequent applications. The book consists of 20 articles based upon the international IFIP conference on this topic held in Valenciennes, France in May 1994.
Anbieter: Celler Versandantiquariat, Eicklingen, Deutschland
Verbandsmitglied: GIAQ
Springer, Wien, 1993. VIII, 309 pages with 199 figures, hard cover, (former library book)--- 736 Gramm.
Sprache: Chinesisch
Verlag: Northwestern Polytechnical University Press, 2000
ISBN 10: 7561230699 ISBN 13: 9787561230695
Anbieter: liu xing, Nanjing, JS, China
paperback. Zustand: New. Paperback. Pub Date: 2011 Pages: 337 Language: Chinese in Publisher: Northwestern Polytechnical University Press colleges 12th Five-Year Plan textbook Mechanical Manufacturing and Automation Series: CAD facing the entire product lifecycle theory and technology system from the point of view for the entire life cycle of products. a combination of theory and practice. the system is a thorough introduction to the basic concepts of a CAD development history. theory. techniques. methods. systems. a.
Anbieter: Brook Bookstore On Demand, Napoli, NA, Italien
EUR 46,22
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: new. Questo è un articolo print on demand.
Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Deutschland
Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools. 324 pp. Englisch.
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
EUR 77,38
Anzahl: 4 verfügbar
In den WarenkorbZustand: New. Print on Demand pp. 324 199 Figures, 67:B&W 6.69 x 9.61 in or 244 x 170 mm (Pinched Crown) Perfect Bound on White w/Gloss Lam.
Anbieter: Biblios, Frankfurt am main, HESSE, Deutschland
Zustand: New. PRINT ON DEMAND pp. 324.
Sprache: Englisch
Verlag: Springer Vienna, Springer Jan 2012, 2012
ISBN 10: 3709193176 ISBN 13: 9783709193174
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 324 pp. Englisch.