Verlag: Cham, Springer International Publishing., 2015
ISBN 10: 331919173X ISBN 13: 9783319191737
Sprache: Englisch
Anbieter: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Deutschland
Aufl. 2015. XXI, 226 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. Lecture Notes in Electrical Engineering ; 350. Sprache: Englisch.
Anbieter: Lucky's Textbooks, Dallas, TX, USA
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In den WarenkorbZustand: New.
Anbieter: Buchpark, Trebbin, Deutschland
Zustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
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In den WarenkorbZustand: New.
Zustand: New. pp. 226.
Zustand: New. pp. 226.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 151,22
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In den WarenkorbPaperback. Zustand: Brand New. reprint edition. 247 pages. 9.25x6.10x0.53 inches. In Stock.
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In den WarenkorbHardcover. Zustand: Brand New. 2015 edition. 250 pages. 9.25x6.25x0.75 inches. In Stock.
Verlag: Springer International Publishing, 2016
ISBN 10: 3319386875 ISBN 13: 9783319386874
Sprache: Englisch
Anbieter: preigu, Osnabrück, Deutschland
Taschenbuch. Zustand: Neu. Three-Dimensional Design Methodologies for Tree-based FPGA Architecture | Vinod Pangracious (u. a.) | Taschenbuch | xxi | Englisch | 2016 | Springer International Publishing | EAN 9783319386874 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Verlag: Springer International Publishing, Springer International Publishing Okt 2016, 2016
ISBN 10: 3319386875 ISBN 13: 9783319386874
Sprache: Englisch
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
Taschenbuch. Zustand: Neu. Neuware -This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 248 pp. Englisch.
Verlag: Springer International Publishing, Springer International Publishing Jul 2015, 2015
ISBN 10: 331919173X ISBN 13: 9783319191737
Sprache: Englisch
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
Buch. Zustand: Neu. Neuware -This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 248 pp. Englisch.
Verlag: Springer International Publishing, Springer International Publishing, 2016
ISBN 10: 3319386875 ISBN 13: 9783319386874
Sprache: Englisch
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D , to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
Verlag: Springer International Publishing, 2015
ISBN 10: 331919173X ISBN 13: 9783319191737
Sprache: Englisch
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D , to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
Anbieter: Mispah books, Redhill, SURRE, Vereinigtes Königreich
EUR 165,27
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In den WarenkorbPaperback. Zustand: Like New. Like New. book.
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EUR 166,44
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In den WarenkorbHardcover. Zustand: Like New. Like New. book.
Verlag: Springer International Publishing Okt 2016, 2016
ISBN 10: 3319386875 ISBN 13: 9783319386874
Sprache: Englisch
Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Deutschland
Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D , to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike. 248 pp. Englisch.
Verlag: Springer International Publishing, Springer International Publishing Jul 2015, 2015
ISBN 10: 331919173X ISBN 13: 9783319191737
Sprache: Englisch
Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Deutschland
Buch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D , to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike. 248 pp. Englisch.
Verlag: Springer International Publishing, 2015
ISBN 10: 331919173X ISBN 13: 9783319191737
Sprache: Englisch
Anbieter: moluna, Greven, Deutschland
EUR 92,27
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In den WarenkorbGebunden. Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. A collection of 3D FPGA architecture exploration, physical design, implementation methodologies and CAD tools for Tree-based FPGA architecture Presents new and practical 3D FPGA interconnect topologies and architecture to improve the performance, .
Verlag: Springer International Publishing, 2016
ISBN 10: 3319386875 ISBN 13: 9783319386874
Sprache: Englisch
Anbieter: moluna, Greven, Deutschland
EUR 92,27
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. A collection of 3D FPGA architecture exploration, physical design, implementation methodologies and CAD tools for Tree-based FPGA architecture Presents new and practical 3D FPGA interconnect topologies and architecture to improve the performance, .
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
EUR 138,77
Anzahl: 4 verfügbar
In den WarenkorbZustand: New. Print on Demand pp. 226.
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
EUR 139,58
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In den WarenkorbZustand: New. Print on Demand pp. 226.
Anbieter: Biblios, Frankfurt am main, HESSE, Deutschland
Zustand: New. PRINT ON DEMAND pp. 226.
Anbieter: Biblios, Frankfurt am main, HESSE, Deutschland
Zustand: New. PRINT ON DEMAND pp. 226.