Verlag: Springer International Publishing, 2015
ISBN 10: 331919173X ISBN 13: 9783319191737
Sprache: Englisch
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In den WarenkorbZustand: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.
Verlag: Cham, Springer International Publishing., 2015
ISBN 10: 331919173X ISBN 13: 9783319191737
Sprache: Englisch
Anbieter: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Deutschland
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In den WarenkorbAufl. 2015. XXI, 226 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. Lecture Notes in Electrical Engineering ; 350. Sprache: Englisch.
Verlag: Springer International Publishing, Springer International Publishing Okt 2016, 2016
ISBN 10: 3319386875 ISBN 13: 9783319386874
Sprache: Englisch
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
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In den WarenkorbTaschenbuch. Zustand: Neu. Neuware -This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 248 pp. Englisch.
Verlag: Springer International Publishing, Springer International Publishing Jul 2015, 2015
ISBN 10: 331919173X ISBN 13: 9783319191737
Sprache: Englisch
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
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In den WarenkorbBuch. Zustand: Neu. Neuware -This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 248 pp. Englisch.
Verlag: Springer International Publishing, 2015
ISBN 10: 331919173X ISBN 13: 9783319191737
Sprache: Englisch
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
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In den WarenkorbBuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D , to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
Verlag: Springer International Publishing, Springer International Publishing, 2016
ISBN 10: 3319386875 ISBN 13: 9783319386874
Sprache: Englisch
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
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In den WarenkorbTaschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D , to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
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In den WarenkorbZustand: New. In.
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In den WarenkorbZustand: New. pp. 226.
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In den WarenkorbZustand: New. pp. 226.
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In den WarenkorbPaperback. Zustand: Brand New. reprint edition. 247 pages. 9.25x6.10x0.53 inches. In Stock.
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In den WarenkorbHardcover. Zustand: Brand New. 2015 edition. 250 pages. 9.25x6.25x0.75 inches. In Stock.
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In den WarenkorbZustand: New.
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In den WarenkorbZustand: New.
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In den WarenkorbHardcover. Zustand: Like New. Like New. book.
Verlag: Springer International Publishing, 2016
ISBN 10: 3319386875 ISBN 13: 9783319386874
Sprache: Englisch
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In den WarenkorbZustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. A collection of 3D FPGA architecture exploration, physical design, implementation methodologies and CAD tools for Tree-based FPGA architecture Presents new and practical 3D FPGA interconnect topologies and architecture to improve the performance, .
Verlag: Springer International Publishing, 2015
ISBN 10: 331919173X ISBN 13: 9783319191737
Sprache: Englisch
Anbieter: moluna, Greven, Deutschland
EUR 92,27
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In den WarenkorbGebunden. Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. A collection of 3D FPGA architecture exploration, physical design, implementation methodologies and CAD tools for Tree-based FPGA architecture Presents new and practical 3D FPGA interconnect topologies and architecture to improve the performance, .
Verlag: Springer International Publishing Okt 2016, 2016
ISBN 10: 3319386875 ISBN 13: 9783319386874
Sprache: Englisch
Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Deutschland
EUR 106,99
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In den WarenkorbTaschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D , to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike. 248 pp. Englisch.
Verlag: Springer International Publishing, Springer International Publishing Jul 2015, 2015
ISBN 10: 331919173X ISBN 13: 9783319191737
Sprache: Englisch
Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Deutschland
EUR 106,99
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In den WarenkorbBuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D , to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike. 248 pp. Englisch.
Anbieter: Biblios, Frankfurt am main, HESSE, Deutschland
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In den WarenkorbZustand: New. PRINT ON DEMAND pp. 226.
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In den WarenkorbZustand: New. Print on Demand pp. 226.
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In den WarenkorbZustand: New. Print on Demand pp. 226.
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In den WarenkorbZustand: New. PRINT ON DEMAND pp. 226.