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Handbook of Thin Film Deposition Techniques Principles, Methods, Equipment and Applications, Second Editon (Materials and Processing Technology) - Hardcover

 
9780815514428: Handbook of Thin Film Deposition Techniques Principles, Methods, Equipment and Applications, Second Editon (Materials and Processing Technology)
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Book by Seshan Krishna

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Reseña del editor:
New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues―as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques.

Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
Biografía del autor:
Formerly Assistant Professor in Materials Science at the University of Arizona and has extensive professional experience as a technologist with both the IBM and Intel Corporations.

Formerly Assistant Professor in Materials Science at the University of Arizona and has extensive professional experience as a technologist with both the IBM and Intel Corporations.

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  • VerlagCRC Press
  • Erscheinungsdatum2002
  • ISBN 10 0815514425
  • ISBN 13 9780815514428
  • EinbandTapa dura
  • Auflage1
  • Anzahl der Seiten72

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