Fundamentals of Microsystems Packaging - Hardcover

Hardcover

ISBN 10: 0071371699 ISBN 13: 9780071371698

Verlag: McGraw-Hill Professional, 2001

Inhaltsangabe

LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes*Basics of electrical and reliability testing

Über diesen Titel

Über die Autorin bzw. den Autor

Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.

Von der hinteren Coverseite

The only book to teach microsystems packaging--written by the field's leading author This is the book that engineers, technicians, and students want―the first to teach microsystems packaging from the ground up. Rao Tummala’s one-stop Fundamentals to Microsystems Packaging covers the field from wafer to systems, including every major contributing technology. It’s the only book to do so. This much-needed tool features:

*A comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems.
*Rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology
*Easy-to-read schematics and block diagrams
*Fundamental approaches to all system issues
*Examples of all common configurations and technologies―wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
*Basics of electrical and reliability testing
*Hundreds of explanatory two-color illustrations
*Self-test problems and solutions in every chapter
*Glossary
*The best way to learn microsystems packaging through self-study or in a classroom―and the most comprehensive on-the-job reference

MICROSystems PACKAGING FROM THE GROUND UP

Details zur Ausgabe

• Verlag: McGraw-Hill Professional
• Erscheinungsdatum: 2001
• Sprache: Englisch
• ISBN 10: 0071371699
• ISBN 13: 9780071371698
• Einband: Gebundene Ausgabe
• Auflage: 1
• Anzahl der Seiten: 967
• Herausgeber: Chapman Steve
• Kontakt zum Hersteller: Nicht verfügbar
• Verantwortliche Person: Nicht verfügbar