Fundamentals microsystems packaging (3 Ergebnisse)

Zustand: like_new. The book looks new but has been read. The cover has no visible wear, and the dust jacket if applicable is included for hard covers. It has no missing or damaged pages, no creases or tears, and no underlining highlighting of text or writing in the margins. It may have very minimal identifying marks on the inside cover as well as very minimal wear and tear. See the seller's listing for full details and a description of any imperfections.…

paperback. Zustand: New. Language:Chinese.Paperback. Publisher: Southeast University Press. The book include: microelectronics. photonics. RF. MEMS base.

Gebunden. Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. &Uumlber den AutorRao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling .…