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Failure Analysis of Integrated Circuits: Tools and Techniques (The Springer International Series in Engineering and Computer Science, 494, Band 494) - Hardcover

Buch 195 von 260: The Springer International Series in Engineering and Computer Science
 
9780412145612: Failure Analysis of Integrated Circuits: Tools and Techniques (The Springer International Series in Engineering and Computer Science, 494, Band 494)
Hardcover
ISBN 10: 0412145618 ISBN 13: 9780412145612
Verlag: Springer, 1999

Inhaltsangabe

Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.
Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.

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Verlag
Springer
Erscheinungsdatum
1999
Sprache
Englisch
ISBN 10 
0412145618
ISBN 13 
9780412145612
Einband
Gebundene Ausgabe
Anzahl der Seiten
268
Herausgeber
Wagner Lawrence C.
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