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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly - Softcover
Inhaltsangabe
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.
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Reseña del editor
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.
Reseña del editor
This guide aims to provide a working understanding of the latest solder paste principles and applications, enabling engineers to take advantage of today's surface mount technology. It shows how to use solder paste technology to improve interconnection performance and efficiency in hybrid circuits, printed circuits, and components. Coverage includes basic solder paste technologies, application techniques, reliability and testing, and solutions to specific problems. This book should be of interest to electronic engineers.
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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
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Paperback. Zustand: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 1.45. Bestandsnummer des Verkäufers G0442013531I3N00
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Solder Paste in Electronics Packaging : Technology and Applications in Surface Mount, Hybrid Circuits, and Component Technology
Verlag:
Van Nostrand Reinhold, New York, 1992
ISBN 10: 0442013531
ISBN 13: 9780442013530
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Paperback. Zustand: Good. First Paperback Edition. minor shelf wear and cover soil, corners lightly bumped, former owners name inside front cover, xxii + 456 pages including appendix and index, covers chemical and physical characteristics, metallurgy, rheology of pastes, soldering methods and application techniques, cleaning, reliability and quality control, testing and related topics, bw illustrations Size: 6 x 9. Bestandsnummer des Verkäufers 006392
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Solder Paste in Electronics Packaging
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Solder Paste in Electronics Packaging
Verlag:
Springer US, Springer US Sep 1992, 1992
ISBN 10: 0442013531
ISBN 13: 9780442013530
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Taschenbuch. Zustand: Neu. Neuware -One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 484 pp. Englisch. Bestandsnummer des Verkäufers 9780442013530
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Solder Paste in Electronics Packaging
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Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology. 484 pp. Englisch. Bestandsnummer des Verkäufers 9780442013530
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Solder Paste in Electronics Packaging : Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
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Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology. Bestandsnummer des Verkäufers 9780442013530
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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
Verlag:
Van Nostrand Reinhold Inc.,U.S., 1992
ISBN 10: 0442013531
ISBN 13: 9780442013530
Neu
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Paperback / softback. Zustand: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 680. Bestandsnummer des Verkäufers C9780442013530
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