Lead-Free Solder Process Development - Hardcover

Hardcover

ISBN 10: 0470410744 ISBN 13: 9780470410745

Verlag: Wiley-IEEE Press, 2011

Inhaltsangabe

"Lead-free Solder Process Development," covers a list of key topics including: legislation, soldering fluxes, SMT, wave, rework, alloys, component finishes, reliability, EDXRF, and standards. It is intended as a reference guide to engineers in the industry who are or who will be migrating to lead-free soldering. It is not intended to be an exhaustive review of the literature but to be a practical reference guide for selected, key subject areas. Each subject area is discussed by those who have conducted work in the field and can provide insight into what are the most important areas to consider. The book gives updates in areas for which research is ongoing, and addresses new topics which are relevant to lead-free soldering.
 
A practicing engineer will find the book of use as it goes into these topics in sufficient detail to make it informative and a good practical guide to address issues of concern in these areas. Chapters on Soldering Fluxes, Component Finishes, Alloys, EDXRF and certain areas on reliability have not been covered in sufficient detail in previous books, so the proposed book will be a timely reference for engineers in the field. The lead-free solder process window has been found to be smaller than for tin-lead, so a specific chapter is dedicated to Six Sigma process methodologies to help engineers approach lead-free soldering processes with better evaluation and process methodologies.

Über diesen Titel

Über die Autorin bzw. den Autor

GREGORY HENSHALL is Master Engineer at Hewlett-Packard Company in Palo Alto, California. He has more than twenty years' experience in materials research and development, including twelve years of experience with soldering alloys and electronics manufacturing and nine years focused on lead-free technology. Dr. Henshall currently serves as chair for the iNEMI (International Electronics Manufacturing Initiative) Lead-Free Alloy Alternatives Project.
 
JASBIR BATH is the owner of Bath Technical Consultancy LLC in Fremont, California. He has over fifteen years' experience in research, design, development, and implementation in the areas of soldering, surface mount, and packaging technologies working for companies including Flextronics International/Solectron Corporation and ITRI (International Tin Research Institute). Bath has been chair of various iNEMI lead-free consortia involving OEMs, EMS, and component and material supplier companies on alloy selection, assembly, and rework.
 
CAROL A. HANDWERKER is the Reinhardt Schuhmann Jr. Professor of Materials Engineering at Purdue University, Indiana. Previously, she was chief of the Metallurgy Division at the National Institute of Standards and Technology (NIST), where she participated in the NCMS (National Center for Manufacturing Sciences) Lead-Free Solder Project and co-chaired the iNEMI Lead-Free Alloy Selection Team. Dr. Handwerker is currently active on the iNEMI Technical, Research, and Environmental Leadership Steering Committees, as well as a participant in a range of iNEMI project teams.

Von der hinteren Coverseite

A fully up-to-date approach to implementing lead-free soldering

Environmental and health concerns have led to a growing movement to eliminate lead from electronics, specifically from electronics soldering. Lead-based solder has been used for many years with a good history of use, so the change to lead-free solder alternatives requires companies to re-examine, develop, and re-test manufacturing processes as they make the transition.

Lead-Free Solder Process Development covers general lead-free soldering topics written by those specializing in these areas. Timely and up to date, this reference covers key topics including legislation, SMT, wave, rework, alloys, test, and reliability. It provides updates in areas where research is ongoing and addresses various topics that are relevant to lead-free soldering, including:

• Government and legislative activities

• Lead-free SMT assembly

• Lead-free wave soldering

• Lead-free rework

• Lead-free alloys for BGA/CSP components

• Lead-free mechanical reliability

• Tin whiskers

• Lead-free reliability in aerospace and military environments

• Lead-free reliability in automotive environments

• Testability of lead-free printed circuit assemblies

Emphasizing practical knowledge of lead-free soldering rather than theory, Lead-Free Solder Process Development is written by experts who are or who have been heavily involved in lead-free implementation at the product level. Being an up-to-date book on this changing field, it is an essential read for engineers in the industry who are or will be migrating to lead-free soldering.

Aus dem Klappentext

A fully up-to-date approach to implementing lead-free soldering
 
Environmental and health concerns have led to a growing movement to eliminate lead from electronics, specifically from electronics soldering. Lead-based solder has been used for many years with a good history of use, so the change to lead-free solder alternatives requires companies to re-examine, develop, and re-test manufacturing processes as they make the transition.
 
Lead-Free Solder Process Development covers general lead-free soldering topics written by those specializing in these areas. Timely and up to date, this reference covers key topics including legislation, SMT, wave, rework, alloys, test, and reliability. It provides updates in areas where research is ongoing and addresses various topics that are relevant to lead-free soldering, including:
* Government and legislative activities
* Lead-free SMT assembly
* Lead-free wave soldering
* Lead-free rework
* Lead-free alloys for BGA/CSP components
* Lead-free mechanical reliability
* Tin whiskers
* Lead-free reliability in aerospace and military environments
* Lead-free reliability in automotive environments
* Testability of lead-free printed circuit assemblies
 
Emphasizing practical knowledge of lead-free soldering rather than theory, Lead-Free Solder Process Development is written by experts who are or who have been heavily involved in lead-free implementation at the product level. Being an up-to-date book on this changing field, it is an essential read for engineers in the industry who are or will be migrating to lead-free soldering.

Details zur Ausgabe

• Verlag: Wiley-IEEE Press
• Erscheinungsdatum: 2011
• Sprache: Englisch
• ISBN 10: 0470410744
• ISBN 13: 9780470410745
• Einband: Gebundene Ausgabe
• Auflage: 1
• Anzahl der Seiten: 284
• Herausgeber: Henshall Greg, Bath Jasbir, Handwerker Carol A.
• Kontakt zum Hersteller: Wiley-VCH GmbH; product_safety@wiley.com; ; Boschstrasse 12; Weinheim; 69469; Deutschland