Advanced Interconnects for ULSI Technology - Hardcover

Baklanov, Mikhail; Ho, Paul S.; Zschech, Ehrenfried

 
9780470662540: Advanced Interconnects for ULSI Technology
Hardcover
ISBN 10: 0470662549 ISBN 13: 9780470662540
Verlag: Wiley, 2012

Inhaltsangabe

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.
 
Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses:
* Interconnect functions, characterisations, electrical properties and wiring requirements
* Low-k materials: fundamentals, advances and mechanical properties
* Conductive layers and barriers
* Integration and reliability including mechanical reliability, electromigration and electrical breakdown
* New approaches including 3D, optical, wireless interchip, and carbon-based interconnects
 
Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.

Über die Autorin bzw. den Autor

Mikhail R. Baklanov
IMEC, Leuven, Belgium

Paul S. Ho
Laboratory for Interconnect and Packaging, University of Texas at Austin, Austin, Texas, USA

Ehrenfried Zschech
Fraunhofer Institute for Nondestructive Testing, Dresden, Germany

Von der hinteren Coverseite

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.

Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses:

  • Interconnect functions, characterisations, electrical properties and wiring requirements
  • Low-k materials: fundamentals, advances and mechanical properties
  • Conductive layers and barriers
  • Integration and reliability including mechanical reliability, electromigration and electrical breakdown
  • New approaches including 3D, optical, wireless interchip, and carbon-based interconnects

Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Aus dem Klappentext

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.
 
Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses:
* Interconnect functions, characterisations, electrical properties and wiring requirements
* Low-k materials: fundamentals, advances and mechanical properties
* Conductive layers and barriers
* Integration and reliability including mechanical reliability, electromigration and electrical breakdown
* New approaches including 3D, optical, wireless interchip, and carbon-based interconnects
 
Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.

Verlag
Wiley
Erscheinungsdatum
2012
Sprache
Englisch
ISBN 10 
0470662549
ISBN 13 
9780470662540
Einband
Gebundene Ausgabe
Auflage
1
Anzahl der Seiten
606
Kontakt zum Hersteller
Wiley-VCH GmbH
product_safety@wiley.com

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