Soldering Processes and Equipment - Hardcover

Hardcover

ISBN 10: 047159167X ISBN 13: 9780471591672

Verlag: Wiley-Interscience, 1993

Inhaltsangabe

Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.

Über diesen Titel

Über die Autorin bzw. den Autor

Michael Pecht is a tenured faculty member with a joint appointment in Systems Research and Mechanical Engineering, and the Director of the CALCE Electronic Packaging Research Center at the University of Maryland. He has an MS in electrical engineering and an MS and PhD in engineering mechanics from the University of Wisconsin. He is a Professional Engineer and an IEEE Fellow. He serves on the board of advisors for various companies and was a West-inghouse Professor. He is the chief editor of the IEEE Transactions on Reliability, and a section editor for the Society of Automotive Engineering.

Details zur Ausgabe

• Verlag: Wiley-Interscience
• Erscheinungsdatum: 1993
• Sprache: Englisch
• ISBN 10: 047159167X
• ISBN 13: 9780471591672
• Einband: Gebundene Ausgabe
• Auflage: 1
• Anzahl der Seiten: 312
• Herausgeber: Pecht Michael G.
• Kontakt zum Hersteller: Wiley-VCH GmbH; product_safety@wiley.com; ; Boschstrasse 12; Weinheim; 69469; Deutschland