Soldering processes equipment (27 Ergebnisse)

Hardcover. Zustand: Near Fine. Zustand des Schutzumschlags: Near Fine. hardback book in near fine condition,dust jacket is also near fine.

Hardcover. Zustand: Very Good. Zustand des Schutzumschlags: Good. 430 pp. Clean sound copy with unmarked text. Good jacket. A truly comprehensive maual for the soldering and cleaning of the widely used printed circuit board. This manual also includes information for the radically new technique of surface mounting. Industry expert Howard H. Manko covers every facet of the field, including design, material selection, the processes, the equipment, inspection and quality, touch up and repair, the management of the line, cost studies, and much more. i1. Book.…

Hardcover. Zustand: UsedVeryGood. Hardcover; signed by the author on title page; light fading, light shelf we ar to exterior; former owner's stamping on front endpaper; otherwise in ver y good condition with clean text, firm binding. Dust jacket, fading, scuffi ng, and shelf wear.

Hardcover. Zustand: Good. Publisher: Van Nostrand Reinhold Company, 1986, Good, HB, ISBN: 0-442-26423-2. Book.

Zustand: Good. 1st Edition. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.…

Zustand: New.

Zustand: New. pp. 312 1st Edition.

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Zustand: new.

Zustand: New. pp. 312.

Zustand: As New. Unread book in perfect condition.

Zustand: New.

Zustand: As New. Unread book in perfect condition.

Zustand: New.

Hardback. Zustand: New. New copy - Usually dispatched within 4 working days.

Zustand: New. In English.

Zustand: New. Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Editor(s): Pecht, Michael. Num Pages: 312 pages, Ill. BIC Classification: TGP; TGX; TJFC. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 242 x 159 x 20. Weight in Grams: 539. . 1993. Hardback. . . . .…

Zustand: New. Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics.

Hardcover. Zustand: Brand New. 1st edition. 312 pages. 9.75x6.50x0.75 inches. In Stock.

Zustand: New. Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Editor(s): Pecht, Michael. Num Pages: 312 pages, Ill. BIC Classification: TGP; TGX; TJFC. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 242 x 159 x 20. Weight in Grams: 539. . 1993. Hardback. . . . . Books ship from the US and Ireland.…

Buch. Zustand: Neu. Neuware - Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.…

Zustand: New.

Zustand: As New. Unread book in perfect condition.

Hardcover. Zustand: new. Hardcover. Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry. Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

Hardcover. Zustand: Brand New. 1st edition. 312 pages. 9.75x6.50x0.75 inches. In Stock. This item is printed on demand.

Hardback. Zustand: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 569.

Zustand: New. PRINT ON DEMAND pp. 312.