Electronics Packaging Forum: Multichip Module Technology Issues: Multichip Modules Technology Issues - Hardcover

Hardcover

ISBN 10: 078030439X ISBN 13: 9780780304390

Verlag: I.E.E.E.Press, 1994

Inhaltsangabe

Based on presentations at the Electronics Packaging Symposium, held at the State University of New York, Binghamton in May 1991, this practical volume provides a multidisciplinary treatment of the field of electronic packaging and multichip modules. Among the topics covered: building long-term reliability by increasing polyimide stability; recent discoveries in the field of soldering phenomena relating to fundamental fluid mechanical processes; how to use the finite-difference time-domain approach in electromagnetic modeling; and the development of dedicated test chips for package evaluation in varied field conditions. Annotation copyright Book News, Inc. Portland, Or.

Details zur Ausgabe

• Verlag: I.E.E.E.Press
• Erscheinungsdatum: 1994
• Sprache: Englisch
• ISBN 10: 078030439X
• ISBN 13: 9780780304390
• Einband: Gebundene Ausgabe
• Anzahl der Seiten: 410
• Herausgeber: Morris James E.
• Kontakt zum Hersteller: Nicht verfügbar
• Verantwortliche Person: Nicht verfügbar