Recent Trends in VLSI and Semiconductor Packaging - Softcover

Softcover

ISBN 10: 1041017871 ISBN 13: 9781041017875

Verlag: CRC Press, 2025

Inhaltsangabe

The Conference aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields.

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Über die Autorin bzw. den Autor

T. Vasudeva Reddy is an Associate Professor in Electronics and Communication Engineering (ECE), B V RAJU Institute of Technology, Narsapur. His expertise lies in enhancing electronic system efficiency, focusing on power consumption, area utilization, and signal delay optimization. His research encompasses Low Power SRAM Architectures, Sub-threshold SRAM Designs, and MEMS Devices for Coagulation Effect, supported by a rich publication record and a commitment to innovative research.

K. Madhava Rao, Assistant Professor at B V RAJU Institute of Technology, Narsapur since 2016, boasts a comprehensive exploration and contribution to electronics and communication engineering. His research covers hardware implementation, low-power techniques, FPGA-based systems, and advanced memory designs, presented at international conferences and esteemed journals.

Details zur Ausgabe

• Verlag: CRC Press
• Erscheinungsdatum: 2025
• Sprache: Englisch
• ISBN 10: 1041017871
• ISBN 13: 9781041017875
• Einband: Taschenbuch
• Auflage: 1
• Anzahl der Seiten: 652
• Herausgeber: Reddy T. Vasudeva, Rao K. Madhava
• Kontakt zum Hersteller: CRC Press; https://www.routledge-ny.com; ; 6000 BROKEN SOUND PARKWAY, NW SUITE 300; BOCA RATON; FL; 33487; USA
• Verantwortliche Person: gpsr@libri.de; gpsr@libri.de; ; Friedensallee 273; Hamburg; 22763; Deutschland