ISBN: 9781041017875 - recent trends in vlsi and semiconductor packaging (15 Ergebnisse)

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Paperback. Zustand: New. The International conference on Semiconductor Materials packaging, AIandML, Reconfigurable VLSI architectures for IoT, future Communication Technologies ("SMART-2024") aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. "SMART-2024" seeked to foster collaboration, innovation, and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targeted a diverse audience including researchers, academicians, scientists, engineers, technologists, industry professionals, students, policymakers, and other stakeholders interested in VLSI, IoT, AI-ML, communication systems, semiconductor packaging, hetero architecture devices, and Nano materials.…

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Paperback. Zustand: New. The International conference on Semiconductor Materials packaging, AIandML, Reconfigurable VLSI architectures for IoT, future Communication Technologies ("SMART-2024") aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. "SMART-2024" seeked to foster collaboration, innovation, and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targeted a diverse audience including researchers, academicians, scientists, engineers, technologists, industry professionals, students, policymakers, and other stakeholders interested in VLSI, IoT, AI-ML, communication systems, semiconductor packaging, hetero architecture devices, and Nano materials.…

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Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. T. Vasudeva Reddy is an Associate Professor in Electronics and Communication Engineering (ECE), B V RAJU Institute of Technology, Narsapur. His expertise lies in enhancing electronic system efficiency, focusing on power consumption, area utilizati.…

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Taschenbuch. Zustand: Neu. Recent Trends in VLSI and Semiconductor Packaging | T. Vasudeva Reddy (u. a.) | Taschenbuch | Einband - flex.(Paperback) | Englisch | 2025 | CRC Press | EAN 9781041017875 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print on Demand. …