Advanced Flip Chip Packaging - Hardcover

 
9781441957672: Advanced Flip Chip Packaging
Hardcover
ISBN 10: 1441957677 ISBN 13: 9781441957672
Verlag: Springer, 2013

Inhaltsangabe

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

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Von der hinteren Coverseite

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

This book also:

  • Offers broad-ranging chapters with a focus on IC-package-system integration
  • Provides viewpoints from leading industry executives and experts
  • Details state-of-the-art achievements in process technologies and scientific research
  • Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information

Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

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Verlag
Springer
Erscheinungsdatum
2013
Sprache
Englisch
ISBN 10 
1441957677
ISBN 13 
9781441957672
Einband
Gebundene Ausgabe
Anzahl der Seiten
567
Herausgeber
Tong Ho-Ming, Lai Yi-Shao, Wong C.P.
Kontakt zum Hersteller
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Heidelberg
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Deutschland

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Vorgestellte Ausgabe

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Softcover