Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture (Woodhead Publishing Series in Electronic and Optical Materials) - Hardcover

Buch 88 von 203: Woodhead Publishing Series in Electronic and Optical Materials

Wong, E-H; Mai, Y.-W.

 
9781845695286: Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture (Woodhead Publishing Series in Electronic and Optical Materials)
Hardcover
ISBN 10: 1845695283 ISBN 13: 9781845695286
Verlag: Woodhead Publishing, 2015

Inhaltsangabe

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.

The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.

The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.

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Über die Autorin bzw. den Autor

Dr Yiu-Wing Mai is Chair and Professor of Mechanical Engineering at the University of Sydney, Australia

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Verlag
Woodhead Publishing
Erscheinungsdatum
2015
Sprache
Englisch
ISBN 10 
1845695283
ISBN 13 
9781845695286
Einband
Gebundene Ausgabe
Auflage
1
Anzahl der Seiten
482
Kontakt zum Hersteller
Nicht verfügbar
Verantwortliche Person
Buchbär
info@buchbaer.de

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