Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing) - Hardcover

Buch 75 von 124: Analog Circuits and Signal Processing

Salah, Khaled; Ismail, Yehea; El-Rouby, Alaa

 
9783319076102: Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing)
Hardcover
ISBN 10: 3319076108 ISBN 13: 9783319076102
Verlag: Springer, 2014

Inhaltsangabe

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

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Von der hinteren Coverseite

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance, and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis, and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor, and inductive-based communication system, and bandpass filtering.

·Introduces a robust model that captures accurately all the loss modes of a TSV, coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region;

·Enables readers to use a model which is technology dependent and can be used for any TSV configuration;

·Reveals a novel on-chip wireless communication technique, based on TSV spiral inductors;

·Equips readers for fast parasitic extraction of TSVs for 3D IC design.

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Verlag
Springer
Erscheinungsdatum
2014
Sprache
Englisch
ISBN 10 
3319076108
ISBN 13 
9783319076102
Einband
Gebundene Ausgabe
Anzahl der Seiten
188
Kontakt zum Hersteller
ProductSafety@springernature.com
ProductSafety@springernature.com

Poststr. 9
Darmstadt
64293
Deutschland

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9783319374970: Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing)

Vorgestellte Ausgabe

ISBN 10:  3319374974 ISBN 13:  9783319374970
Verlag: Springer, 2016
Softcover