Heat Transfer Enhancement by Using Micro-Channel: Air Conditioning and Refrigeration Engineering - Softcover
Inhaltsangabe
There have been few studies on a three-dimensional noncircular microchannel carried out to look into the effect of different shapes on the heat transfer and fluid flow. 25 years ago, many researchers have been able to illustrate that high heat fluxes could be dissipated by a fluid flowing through microchannels that offer an increased surface area to volume ratio. Microchannels can be formed in a straightforward manner on the chip integrated circuit substrate. The strength of the location on the substrate is evident in the reduced thermal resistance from the heat source to the heat sink. To avoid any interruption to the circuit function, the microchannels can be built onto the electrically inactive side of the chip, and the dimensional double pipe heat exchanger has been carried out to investigate the effect of louvered strips inserts on the heat transfer rate, skin friction coefficient and the performance evaluation criteria (PEC).The expansion of manufacturing of small devises demanded a better understanding of fluid flow and heat transfer in microgeometries.
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Über die Autorin bzw. den Autor
Doutoramento em Engenharia Mecânica, Universidade Nacional da Malásia, UKM 2017. As suas principais contribuições são em colector térmico fotovoltaico, produção de hidrogénio, sistema de aquecimento solar, dessalinização solar, arrefecimento solar, solar, sistema de secagem, publicou três patentes e vinte trabalhos de investigação a nível internacional.
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Heat Transfer Enhancement by Using Micro-Channel
Verlag:
LAP LAMBERT Academic Publishing Jun 2018, 2018
ISBN 10: 6139839351
ISBN 13: 9786139839353
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Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -There have been few studies on a three-dimensional noncircular microchannel carried out to look into the effect of different shapes on the heat transfer and fluid flow. 25 years ago, many researchers have been able to illustrate that high heat fluxes could be dissipated by a fluid flowing through microchannels that offer an increased surface area to volume ratio. Microchannels can be formed in a straightforward manner on the chip integrated circuit substrate. The strength of the location on the substrate is evident in the reduced thermal resistance from the heat source to the heat sink. To avoid any interruption to the circuit function, the microchannels can be built onto the electrically inactive side of the chip, and the dimensional double pipe heat exchanger has been carried out to investigate the effect of louvered strips inserts on the heat transfer rate, skin friction coefficient and the performance evaluation criteria (PEC).The expansion of manufacturing of small devises demanded a better understanding of fluid flow and heat transfer in microgeometries. 52 pp. Englisch. Bestandsnummer des Verkäufers 9786139839353
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Heat Transfer Enhancement by Using Micro-Channel
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Heat Transfer Enhancement by Using Micro-Channel
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Heat Transfer Enhancement by Using Micro-Channel
Verlag:
LAP LAMBERT Academic Publishing, 2018
ISBN 10: 6139839351
ISBN 13: 9786139839353
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Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Hasan Husam AbdulrasoolPhD. in Mechanical Engineering, National Universityin Malaysia, UKM 2017.he is a lecturer at AL-ESRA AUNIVERSITY.His main contributions are in Photovoltaicthermal collector, hydrogen production, solarheating sy. Bestandsnummer des Verkäufers 385873657
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Heat Transfer Enhancement by Using Micro-Channel
Verlag:
LAP LAMBERT Academic Publishing Jun 2018, 2018
ISBN 10: 6139839351
ISBN 13: 9786139839353
Neu
Taschenbuch
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Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -There have been few studies on a three-dimensional noncircular microchannel carried out to look into the effect of different shapes on the heat transfer and fluid flow. 25 years ago, many researchers have been able to illustrate that high heat fluxes could be dissipated by a fluid flowing through microchannels that offer an increased surface area to volume ratio. Microchannels can be formed in a straightforward manner on the chip integrated circuit substrate. The strength of the location on the substrate is evident in the reduced thermal resistance from the heat source to the heat sink. To avoid any interruption to the circuit function, the microchannels can be built onto the electrically inactive side of the chip, and the dimensional double pipe heat exchanger has been carried out to investigate the effect of louvered strips inserts on the heat transfer rate, skin friction coefficient and the performance evaluation criteria (PEC).The expansion of manufacturing of small devises demanded a better understanding of fluid flow and heat transfer in microgeometries.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 52 pp. Englisch. Bestandsnummer des Verkäufers 9786139839353
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Heat Transfer Enhancement by Using Micro-Channel : Air Conditioning and Refrigeration Engineering
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Taschenbuch. Zustand: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - There have been few studies on a three-dimensional noncircular microchannel carried out to look into the effect of different shapes on the heat transfer and fluid flow. 25 years ago, many researchers have been able to illustrate that high heat fluxes could be dissipated by a fluid flowing through microchannels that offer an increased surface area to volume ratio. Microchannels can be formed in a straightforward manner on the chip integrated circuit substrate. The strength of the location on the substrate is evident in the reduced thermal resistance from the heat source to the heat sink. To avoid any interruption to the circuit function, the microchannels can be built onto the electrically inactive side of the chip, and the dimensional double pipe heat exchanger has been carried out to investigate the effect of louvered strips inserts on the heat transfer rate, skin friction coefficient and the performance evaluation criteria (PEC).The expansion of manufacturing of small devises demanded a better understanding of fluid flow and heat transfer in microgeometries. Bestandsnummer des Verkäufers 9786139839353
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Heat Transfer Enhancement by Using Micro-Channel | Air Conditioning and Refrigeration Engineering
Verlag:
LAP LAMBERT Academic Publishing, 2018
ISBN 10: 6139839351
ISBN 13: 9786139839353
Neu
Taschenbuch
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Taschenbuch. Zustand: Neu. Heat Transfer Enhancement by Using Micro-Channel | Air Conditioning and Refrigeration Engineering | Husam Abdulrasool Hasan | Taschenbuch | 52 S. | Englisch | 2018 | LAP LAMBERT Academic Publishing | EAN 9786139839353 | Verantwortliche Person für die EU: BoD - Books on Demand, In de Tarpen 42, 22848 Norderstedt, info[at]bod[dot]de | Anbieter: preigu. Bestandsnummer des Verkäufers 115190470
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