ISBN: 9786139839353 - heat transfer enhancement by using micro-channel: air conditioning and refrigeration engineering (8 Ergebnisse)

Zustand: New.

Taschenbuch. Zustand: Neu. Heat Transfer Enhancement by Using Micro-Channel | Air Conditioning and Refrigeration Engineering | Husam Abdulrasool Hasan | Taschenbuch | 52 S. | Englisch | 2018 | LAP LAMBERT Academic Publishing | EAN 9786139839353 | Verantwortliche Person für die EU: BoD - Books on Demand, In de Tarpen 42, 22848 Norderstedt, info[at]bod[dot]de | Anbieter: preigu.…

Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -There have been few studies on a three-dimensional noncircular microchannel carried out to look into the effect of different shapes on the heat transfer and fluid flow. 25 years ago, many researchers have been able to illustrate that high heat fluxes could be dissipated by a fluid flowing through microchannels that offer an increased surface area to volume ratio. Microchannels can be formed in a straightforward manner on the chip integrated circuit substrate. The strength of the location on the substrate is evident in the reduced thermal resistance from the heat source to the heat sink. To avoid any interruption to the circuit function, the microchannels can be built onto the electrically inactive side of the chip, and the dimensional double pipe heat exchanger has been carried out to investigate the effect of louvered strips inserts on the heat transfer rate, skin friction coefficient and the performance evaluation criteria (PEC).The expansion of manufacturing of small devises demanded a better understanding of fluid flow and heat transfer in microgeometries. 52 pp. Englisch.…

Zustand: New. Print on Demand.

Zustand: New. PRINT ON DEMAND.

Taschenbuch. Zustand: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - There have been few studies on a three-dimensional noncircular microchannel carried out to look into the effect of different shapes on the heat transfer and fluid flow. 25 years ago, many researchers have been able to illustrate that high heat fluxes could be dissipated by a fluid flowing through microchannels that offer an increased surface area to volume ratio. Microchannels can be formed in a straightforward manner on the chip integrated circuit substrate. The strength of the location on the substrate is evident in the reduced thermal resistance from the heat source to the heat sink. To avoid any interruption to the circuit function, the microchannels can be built onto the electrically inactive side of the chip, and the dimensional double pipe heat exchanger has been carried out to investigate the effect of louvered strips inserts on the heat transfer rate, skin friction coefficient and the performance evaluation criteria (PEC).The expansion of manufacturing of small devises demanded a better understanding of fluid flow and heat transfer in microgeometries.…

Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Hasan Husam AbdulrasoolPhD. in Mechanical Engineering, National Universityin Malaysia, UKM 2017.he is a lecturer at AL-ESRA AUNIVERSITY.His main contributions are in Photovoltaicthermal collector, hydrogen production, solarheating sy.…

Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -There have been few studies on a three-dimensional noncircular microchannel carried out to look into the effect of different shapes on the heat transfer and fluid flow. 25 years ago, many researchers have been able to illustrate that high heat fluxes could be dissipated by a fluid flowing through microchannels that offer an increased surface area to volume ratio. Microchannels can be formed in a straightforward manner on the chip integrated circuit substrate. The strength of the location on the substrate is evident in the reduced thermal resistance from the heat source to the heat sink. To avoid any interruption to the circuit function, the microchannels can be built onto the electrically inactive side of the chip, and the dimensional double pipe heat exchanger has been carried out to investigate the effect of louvered strips inserts on the heat transfer rate, skin friction coefficient and the performance evaluation criteria (PEC).The expansion of manufacturing of small devises demanded a better understanding of fluid flow and heat transfer in microgeometries.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 52 pp. Englisch.…