Grain Structures & Effects of Stress on Grain Boundaries - Softcover

Sharma, Manvinder; Khosla, Dishant; Singh, Sohni

 
9786139877874: Grain Structures & Effects of Stress on Grain Boundaries
Softcover
ISBN 10: 6139877873 ISBN 13: 9786139877874
Verlag: LAP LAMBERT Academic Publishing, 2018

Inhaltsangabe

Developing higher density microelectronics devices is the impact of the stresses induced by Coefficient of Thermal Expansion (CTE) mismatches of the materials used. Here I discuss the use of 3D grain continuum modeling to study grain boundary migration driven by differences in strain energy density. Comsol Multiphysics 4.3a (CM) is being used to compute stresses and strain energy densities in polycrystalline structures caused by temperature changes. We treat each grain as a single crystal, with the anisotropic elastic properties of single crystal Cu appropriately rotated to match grain orientation in space.

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Über die Autorin bzw. den Autor

Manvinder Sharma is currently working as Assistant Professor in Department of Electronics and Communication at CGC College of Engineering, Mohali. He has done M.Tech in VLSI and B.Tech in ECE.

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Verlag
LAP LAMBERT Academic Publishing
Erscheinungsdatum
2018
Sprache
Englisch
ISBN 10 
6139877873
ISBN 13 
9786139877874
Einband
Taschenbuch
Anzahl der Seiten
68
Kontakt zum Hersteller
Nicht verfügbar
Verantwortliche Person
Fastbook Publishing
customerservice@vdm-vsg.de

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Riga
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