Isbn: 9786139877874 - grain structures & effects of stress on grain boundaries (6 Ergebnisse)

Paperback. Zustand: Brand New. 68 pages. 8.66x5.91x0.16 inches. In Stock.

Taschenbuch. Zustand: Neu. Grain Structures & Effects of Stress on Grain Boundaries | Manvinder Sharma (u. a.) | Taschenbuch | 68 S. | Englisch | 2018 | LAP LAMBERT Academic Publishing | EAN 9786139877874 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.…

Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Developing higher density microelectronics devices is the impact of the stresses induced by Coefficient of Thermal Expansion (CTE) mismatches of the materials used. Here I discuss the use of 3D grain continuum modeling to study grain boundary migration driven by differences in strain energy density. Comsol Multiphysics 4.3a (CM) is being used to compute stresses and strain energy densities in polycrystalline structures caused by temperature changes. We treat each grain as a single crystal, with the anisotropic elastic properties of single crystal Cu appropriately rotated to match grain orientation in space. 68 pp. Englisch.…

Taschenbuch. Zustand: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Developing higher density microelectronics devices is the impact of the stresses induced by Coefficient of Thermal Expansion (CTE) mismatches of the materials used. Here I discuss the use of 3D grain continuum modeling to study grain boundary migration driven by differences in strain energy density. Comsol Multiphysics 4.3a (CM) is being used to compute stresses and strain energy densities in polycrystalline structures caused by temperature changes. We treat each grain as a single crystal, with the anisotropic elastic properties of single crystal Cu appropriately rotated to match grain orientation in space.…

Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Sharma ManvinderManvinder Sharma is currently working as Assistant Professor in Department of Electronics and Communication at CGC College of Engineering, Mohali. He has done M.Tech in VLSI and B.Tech in ECE.Developing higher den.…

Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Developing higher density microelectronics devices is the impact of the stresses induced by Coefficient of Thermal Expansion (CTE) mismatches of the materials used. Here I discuss the use of 3D grain continuum modeling to study grain boundary migration driven by differences in strain energy density. Comsol Multiphysics 4.3a (CM) is being used to compute stresses and strain energy densities in polycrystalline structures caused by temperature changes. We treat each grain as a single crystal, with the anisotropic elastic properties of single crystal Cu appropriately rotated to match grain orientation in space.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 68 pp. Englisch.…