9787515921648 (1 Ergebnisse)
3D Integration Handbook Volume 3 Three-Dimensional Process Technology(Chinese Edition)
[ MEI ] FEI LI PU· JIA LUO ( Philip Garrou ) . [ RI ] XIAO LIU GUANG ZHENG ( Mitsumasa Koyanagi ) . [ DE ] BI DE· LA MU ( Peter Ramm ) . WU DAO WEI . WANG WEI . LIU JIAN JUN . YU HUAN DENG YI
Sprache: Englisch
- Hardcover
Anbieter: liu xing, Nanjing, JS, Chinaliu xing
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 143,94
EUR 15,79 VersandVersand von China nach USAAnzahl: 3 verfügbar
Hardcover. Zustand: New. HardCover.Pub Date:2022-10 Pages:369 Language:ChinesePublisher:China Aerospace PressSelf-operated3D Integration Handbook Volume 3 Three-Dimensional Process Technologyis divided into 22 chapters. namely: 3D IC integration since 2008. main applications and market trends of 3D integration and interposer tec…hnology. economic drivers and barriers to 2.5D/3D integration. interposer technology. TSV manufacturing overview. TSV unit process and integration. TSV preparation of ASET. laser-assisted wafe.
