Manufacturability and yield are no longer a fabrication, packaging, and test concerns. They are aspects that have to be designed in, and they are everybody’s responsibility. Design for Manufacturability and Yield for Nano-Scale CMOS walks the reader through all the aspects of manufacturability and yield in a nano-CMOS process and how to address each aspect at the proper design step starting with the layout of standard cells and how to yield-grade libraries for critical area and lithography artifacts through place and route, CMP model based simulation and dummy-fill insertion, and through statistical timing closure of the design. It alerts the designer to the pitfalls to watch for and to the good practices that can enhance a design’s manufacturability and yield. A must read book for the serious designer.
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Dr. Charles Chiang is R&D Director of the Advanced Technology Group at Synopsys Inc. in Mountain View, CA, USA
As we approach the 32 nm CMOS technology node the design and manufacturing communities are dealing with a lithography system that has to print circuit artifacts that are significantly less than half the wavelength of the light source used, with new materials, with tighter pitches, and higher aspect ratio metallurgies. This reality has resulted in three main manufacturability issues that have to be addressed: printability, planarization, and intra-die variability. Addressing in depth the fundamentals impacting those three issues at all the stages of the design process is not a luxury one can ignore. Manufacturability and yield are now one and the same and are no longer a fabrication, packaging, and test concerns; they are the concern of the whole IC community. Yield and manufacturability have to be designed in, and they are everybody’s responsibility.
Design for Manufacturability and Yield for Nano-Scale CMOS walks the reader through all the aspects of manufacturability and yield in a nano-CMOS process and how to address each aspect at the proper design step starting with the design and layout of standard cells and how to yield-grade libraries for critical area and lithography artifacts through place and route, CMP model based simulation and dummy-fill insertion, mask planning, simulation and manufacturing, and through statistical design and statistical timing closure of the design. It alerts the designer to the pitfalls to watch for and to the good practices that can enhance a design’s manufacturability and yield. This book is a must read book the serious practicing IC designer and an excellent primer for any graduate student intent on having a career in IC design or in EDA tool development.
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Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book walks the reader through all the aspects of manufacturability and yield in a nano-CMOS process. It covers all CAD/CAE aspects of a SOC design flow and addresses a new topic (DFM/DFY) critical at 90 nm and beyond. This book is a must read book the serious practicing IC designer and an excellent primer for any graduate student intent on having a career in IC design or in EDA tool development. 288 pp. Englisch. Bestandsnummer des Verkäufers 9789048173037
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Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Addressing a new topic (DFM/DFY) critical at 90 nm and beyondNo book available today with comprehensive coverage of this topicBook covers all CAD/CAE aspects of a SOC design flowDr. Charles Chiang is R&D Director of the Advanced. Bestandsnummer des Verkäufers 5821147
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Taschenbuch. Zustand: Neu. Design for Manufacturability and Yield for Nano-Scale CMOS | Charles Chiang (u. a.) | Taschenbuch | xxvii | Englisch | 2010 | Springer | EAN 9789048173037 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. Bestandsnummer des Verkäufers 107219120
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