High Performance Design Automation For Multi-chip Modules And Packages (Current Topics in Electronics and Systems, Vol 5, Band 5) - Hardcover

 
9789810223076: High Performance Design Automation For Multi-chip Modules And Packages (Current Topics in Electronics and Systems, Vol 5, Band 5)
Hardcover
ISBN 10: 9810223072 ISBN 13: 9789810223076
Verlag: World Scientific Publishing Co Pte Ltd, 1996

Inhaltsangabe

Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.

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Verlag
World Scientific Publishing Co Pte Ltd
Erscheinungsdatum
1996
Sprache
Englisch
ISBN 10 
9810223072
ISBN 13 
9789810223076
Einband
Gebundene Ausgabe
Anzahl der Seiten
264
Herausgeber
Cho Jun-Dong, Franzon Paul D.
Kontakt zum Hersteller
Nicht verfügbar
Verantwortliche Person
Nicht verfügbar