Cho jun dong (24 Ergebnisse)

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Zustand: Très bon. High Performance Design Automation for Multi-Chip Modules and Packages | Cho, Jun-Dong | World Scientific Pub Co Inc, 1996. In-8° cartonné, 254p . Couverture propre . Dos solide. Intérieur frais sans soulignage ou annotation. Exemplaire de bibliothèque : petit code barre en pied de 1re de couv., cotation au dos, rares et discrets petits tampons à l'intérieur de l'ouvrage.Très bon état général pour cet ouvrage. [Ba 52+] Pour les expéditions internationales, nous consulter au préalable pour l ajustement des frais de port qui seront peut-être revus à la baisse/ For international shipments, please contact us in advance to adjust shipping costs. |.…

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Hardcover. Zustand: new. Hardcover. Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

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Hardcover. Zustand: Brand New. 254 pages. 10.25x7.00x0.75 inches. In Stock.

Zustand: New. KlappentextrnrnThe aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partiti.

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Hardcover. Zustand: new. Hardcover. Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.…

Zustand: New. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Editor(s): Cho, Jun Dong; Franzon, Paul D.; Sarrafzadeh, M. Series: Selected Topics in Electronics and Systems. Num Pages: 264 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 220. . . 1996. hardcover. . . . . Books ship from the US and Ireland. …

Zustand: New. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Editor(s): Cho, Jun Dong; Franzon, Paul D.; Sarrafzadeh, M. Series: Selected Topics in Electronics and Systems. Num Pages: 264 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 220. . . 1996. hardcover. . . . . …

HRD. Zustand: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

HRD. Zustand: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

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Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. KlappentextrnrnThis book conveyed the visual elements of artwork to the visually impaired through various sensory elements to open a new perspective for appreciating visual artwork. In addition, the technique of expressing a color code by integr.…

Buch. Zustand: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This book conveyed the visual elements of artwork to the visually impaired through various sensory elements to open a new perspective for appreciating visual artwork. In addition, the technique of expressing a color code by integrating patterns, temperatures, scents, music, and vibrations was explored, and future research topics were presented. A holistic experience using multi-sensory interaction acquired by people with visual impairment was provided to convey the meaning and contents of the work through rich multi-sensory appreciation. A method that allows people with visual impairments to engage in artwork using a variety of senses, including touch, temperature, tactile pattern, and sound, helps them to appreciate artwork at a deeper level than can be achieved with hearing or touch alone. The development of such art appreciation aids for the visually impaired will ultimately improve their cultural enjoyment and strengthen their access to culture and the arts. The development of this new concept aids ultimately expands opportunities for the non-visually impaired as well as the visually impaired to enjoy works of art and breaks down the boundaries between the disabled and the non-disabled in the field of culture and arts through continuous efforts to enhance accessibility. In addition, the developed multi-sensory expression and delivery tool can be used as an educational tool to increase product and artwork accessibility and usability through multi-modal interaction. Training the multi-sensory experiences introduced in this book may lead to more vivid visual imageries or seeing with the mind's eye.…

Buch. Zustand: Neu. Multi-Sensory Interaction for Blind and Visually Impaired People | Jun Dong Cho | Buch | Gebunden | Englisch | 2022 | MDPI AG | EAN 9783036530581 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print on Demand.…