Thermal Reliability of Power Semiconductor Device in the Renewable Energy System (CPSS Power Electronics Series) - Softcover

Du, Xiong; Zhang, Jun; Li, Gaoxian; Yu, Yaoyi; Qian, Cheng; Du, Rui

 
9789811931345: Thermal Reliability of Power Semiconductor Device in the Renewable Energy System (CPSS Power Electronics Series)
Softcover
ISBN 10: 9811931348 ISBN 13: 9789811931345
Verlag: Springer, 2023

Inhaltsangabe

This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. 

Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.

Über die Autorin bzw. den Autor

Xiong Du obtained his B.S., M.S., and Ph. D. degrees from Chongqing University, China in 2000, 2002, and 2005 respectively, all in the Electrical Engineering. He has been with Chongqing University since 2002 and is currently a full professor in the School of Electrical Engineering, Chongqing University. He was a visiting scholar at Rensselaer Polytechnic Institute, Troy, NY from July 2007 to July 2008. His research interests include power electronics system reliability and stability. He is a recipient of the National Excellent Doctoral Dissertation of P.R. China in 2008.

Jun Zhang obtained his B.S. degree from Anhui University, China, in 2014 and Ph. D. degree from Chongqing University, China, in 2019, all in the Electrical Engineering. He is currently working as a lecture in the College of Energy and Electrical Engineering, Hohai University, Nanjing, China. His research interests include the reliability of power electronics system.

Von der hinteren Coverseite

This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. 

„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.

Verlag
Springer
Erscheinungsdatum
2023
Sprache
Englisch
ISBN 10 
9811931348
ISBN 13 
9789811931345
Einband
Taschenbuch
Auflage
1
Anzahl der Seiten
188
Kontakt zum Hersteller
ProductSafety@springernature.com
ProductSafety@springernature.com

Poststr. 9
Darmstadt
64293
Deutschland

Weitere beliebte Ausgaben desselben Titels

9789811931314: Thermal Reliability of Power Semiconductor Device in the Renewable Energy System (CPSS Power Electronics Series)

Vorgestellte Ausgabe

ISBN 10:  9811931313 ISBN 13:  9789811931314
Verlag: Springer, 2022
Hardcover