9789811931345 - thermal reliability of power semiconductor device in the renewable energy system (cpss power electronics series) von du, xiong; zhang, jun; li, gaoxian; yu, yaoyi; qian, cheng; du, rui (10 Ergebnisse)

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. …

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Taschenbuch. Zustand: Neu. Thermal Reliability of Power Semiconductor Device in the Renewable Energy System | Xiong Du (u. a.) | Taschenbuch | CPSS Power Electronics Series | xvi | Englisch | 2023 | Springer | EAN 9789811931345 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

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Zustand: new. Questo è un articolo print on demand.

Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. 188 pp. Englisch.…

Kartoniert / Broschiert. Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimenta.…

Zustand: New. Print on Demand.

Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 188 pp. Englisch.…

Zustand: New. PRINT ON DEMAND.