Reliability Technology for Integrated Circuit Packaging - Hardcover

Zhou, Bin; En, Yunfei; Chen, Si

Hardcover

ISBN 10: 981953884X ISBN 13: 9789819538843

Verlag: Springer, 2026

Inhaltsangabe

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.

Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.

Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.

Über diesen Titel

Von der hinteren Coverseite

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.

Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.

Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.

Details zur Ausgabe

• Verlag: Springer
• Erscheinungsdatum: 2026
• Sprache: Englisch
• ISBN 10: 981953884X
• ISBN 13: 9789819538843
• Einband: Gebundene Ausgabe
• Anzahl der Seiten: 538
• Kontakt zum Hersteller: Springer Nature Customer Service Center GmbH; ProductSafety@springernature.com; ; Tiergartenstr. 17; Heidelberg; 69121; Deutschland