Fan-out wafer-level packaging. panel-level packaging and embedded technology: High-performance computing (HPC) and system-in-package (SiP)(Chinese Edition)

[ MEI ] BEI SI&amp#183; KAI SE ( Beth Keser ) . [ DE ] SI DI FEN&amp#183; KE LUO NA TE

ISBN 10: 7111755804 ISBN 13: 9787111755807

Verlag: Mechanical Industry Press, 2024

Sprache: Englisch

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Language:Chinese.Paperback. Pub Date: 2024-06 Pages: 268 Publisher: China Machine Press The book Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology was written by Dr. Beth Keser. former president of the International Microelectronics Assembly and Packaging Society (IMAPS). and translated by the 43rd Institute of China Electronics Technology Group Corporation. Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology explains various fan-out and e.

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Bibliografische Details

Titel: Fan-out wafer-level packaging. panel-level packaging and embedded technology: High-performance computing (HPC) and system-in-package (SiP)(Chinese Edition)
Verlag: Mechanical Industry Press
Erscheinungsjahr: 2024
Sprache: Englisch
ISBN-10: 7111755804
ISBN-13: 9787111755807
Einband: paperback
Zustand: New

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