Anbieter: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Deutschland
viii, 189 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
Hardcover. Zustand: Good. Satisfaction 100% guaranteed.
Anbieter: Corner of a Foreign Field, Tokyo, TOKYO, Japan
Erstausgabe
Hardcover. Zustand: New. No Jacket. 1st Edition. 2015.Hardcover.New.Ships from Japan.Usually ships in 1-2 working days.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 164,57
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 164,57
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Zustand: New. pp. 197.
Taschenbuch. Zustand: Neu. Nanopackaging: From Nanomaterials to the Atomic Scale | Proceedings of the 1st International Workshop on Nanopackaging, Grenoble 27-28 June 2013 | Xavier Baillin (u. a.) | Taschenbuch | Advances in Atom and Single Molecule Machines | viii | Englisch | 2016 | Springer | EAN 9783319356501 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Zustand: New. pp. 207.
Sprache: Englisch
Verlag: Springer International Publishing, 2015
ISBN 10: 3319211935 ISBN 13: 9783319211930
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community.
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community.
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
EUR 237,98
Anzahl: 2 verfügbar
In den WarenkorbHardcover. Zustand: Brand New. 200 pages. 9.25x6.25x0.75 inches. In Stock.
Anbieter: Mispah books, Redhill, SURRE, Vereinigtes Königreich
EUR 226,83
Anzahl: 1 verfügbar
In den WarenkorbHardcover. Zustand: Like New. Like New. book.
Anbieter: Mispah books, Redhill, SURRE, Vereinigtes Königreich
EUR 235,19
Anzahl: 1 verfügbar
In den WarenkorbPaperback. Zustand: Like New. Like New. book.
Anbieter: Brook Bookstore On Demand, Napoli, NA, Italien
EUR 126,26
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: new. Questo è un articolo print on demand.
Anbieter: Brook Bookstore On Demand, Napoli, NA, Italien
EUR 126,26
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: new. Questo è un articolo print on demand.
Sprache: Englisch
Verlag: Springer International Publishing, Springer International Publishing Aug 2015, 2015
ISBN 10: 3319211935 ISBN 13: 9783319211930
Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Deutschland
Buch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community. 200 pp. Englisch.
Sprache: Englisch
Verlag: Springer International Publishing Okt 2016, 2016
ISBN 10: 331935650X ISBN 13: 9783319356501
Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Deutschland
Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community. 200 pp. Englisch.
Sprache: Englisch
Verlag: Springer International Publishing, 2016
ISBN 10: 331935650X ISBN 13: 9783319356501
Anbieter: moluna, Greven, Deutschland
EUR 136,16
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Offers a multi-disciplinary approach to the packaging fieldDiscusses the latest developments in packaging specifications and technological developments in the study of atomic scale circuits and devicesProvides information for the use of CNT.
Sprache: Englisch
Verlag: Springer International Publishing, 2015
ISBN 10: 3319211935 ISBN 13: 9783319211930
Anbieter: moluna, Greven, Deutschland
EUR 136,16
Anzahl: Mehr als 20 verfügbar
In den WarenkorbGebunden. Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Offers a multi-disciplinary approach to the packaging fieldDiscusses the latest developments in packaging specifications and technological developments in the study of atomic scale circuits and devicesProvides information for the use of CNT.
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
EUR 220,85
Anzahl: 4 verfügbar
In den WarenkorbZustand: New. Print on Demand pp. 197.
Sprache: Englisch
Verlag: Springer, Springer Aug 2015, 2015
ISBN 10: 3319211935 ISBN 13: 9783319211930
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
Buch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 200 pp. Englisch.
Sprache: Englisch
Verlag: Springer, Springer Okt 2016, 2016
ISBN 10: 331935650X ISBN 13: 9783319356501
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 200 pp. Englisch.
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
EUR 227,19
Anzahl: 4 verfügbar
In den WarenkorbZustand: New. Print on Demand pp. 207.
Anbieter: Biblios, Frankfurt am main, HESSE, Deutschland
Zustand: New. PRINT ON DEMAND pp. 197.
Anbieter: Biblios, Frankfurt am main, HESSE, Deutschland
Zustand: New. PRINT ON DEMAND pp. 207.