Bender joseph b (25 Ergebnisse)

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Large Softcover. Zustand: Very Good. Edgewear. Ten chapters. Fundamentals of Engineering Graphics.

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Hardback. Zustand: New. RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality and Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the 'physics of failure', combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditionsDetailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and moreNew multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.…

Zustand: New. 2024. 1st Edition. hardcover. . . . . .

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Zustand: New. 2024. 1st Edition. hardcover. . . . . . Books ship from the US and Ireland.

Hardback. Zustand: New. RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality and Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the 'physics of failure', combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditionsDetailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and moreNew multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.…

Hardcover. Zustand: gut. 2024. Reliability Prediction for Microelectronics In englischer Sprache. pages.

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OLwd. m. geprägtem Rücken- u. Deckeltitel u. OU. Gr.8°, 176 S. OU etw. unfrisch u. mit 2 Randrissen oben, Kopf- u. Seitenschnitt etw. stockfleckig, Buch sonst tadellos. 3. [, erweiterte] Auflage. Mit dem Vorwort von J. B. Rhine: «Über Hans Driesch» (3 S.); im Anhang: Hans Bender: «Zur Entwicklung der Parapsychologie von 1930 - 1950» (S. 135 ff.).…

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