Zustand: Good. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
EUR 30,72
Anzahl: 1 verfügbar
In den WarenkorbZustand: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has soft covers. Clean from markings. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1900grams, ISBN:9780071283731.
Sprache: Englisch
Verlag: Harbin Institute of Technology Press, 2019
ISBN 10: 7560366589 ISBN 13: 9787560366586
Anbieter: liu xing, Nanjing, JS, China
paperback. Zustand: New. Paperback. Pub Date: 2019-06-01 Pages: 846 Language: English Publisher: Harbin Institute of Technology Press As recently as a decade ago our students used to ask us. How do I use stat .
EUR 92,84
Anzahl: 1 verfügbar
In den WarenkorbPaperback. Zustand: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Sprache: Englisch
Verlag: McGraw Hill Higher Education, 2006
ISBN 10: 0071108149 ISBN 13: 9780071108140
Anbieter: Mispah books, Redhill, SURRE, Vereinigtes Königreich
EUR 110,70
Anzahl: 1 verfügbar
In den WarenkorbHardcover. Zustand: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Sprache: Englisch
Verlag: Addison Wesley Longman Publishing Co, 1988
ISBN 10: 0201118203 ISBN 13: 9780201118209
Anbieter: Mispah books, Redhill, SURRE, Vereinigtes Königreich
EUR 226,16
Anzahl: 1 verfügbar
In den WarenkorbSpiral-bound. Zustand: Good. Good. Dust Jacket NOT present. CD WILL BE MISSING. . SHIPS FROM MULTIPLE LOCATIONS. book.
Sprache: Englisch
Verlag: Kluwer Academic Publishers Group, 1992
ISBN 10: 0442012365 ISBN 13: 9780442012366
Anbieter: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irland
Zustand: New. Provides a framework for understanding the multichip module (MCM) technologies available for package selection. This book is useful for engineers concerned with the design and systems integration of products and technical managers who decide how to apply to technologies. Num Pages: 875 pages, biography. BIC Classification: UM. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 229 x 152 x 55. Weight in Grams: 1500. . 1992. Hardback. . . . .
Sprache: Englisch
Verlag: Kluwer Academic Publishers Group, 1992
ISBN 10: 0442012365 ISBN 13: 9780442012366
Anbieter: Kennys Bookstore, Olney, MD, USA
Zustand: New. Provides a framework for understanding the multichip module (MCM) technologies available for package selection. This book is useful for engineers concerned with the design and systems integration of products and technical managers who decide how to apply to technologies. Num Pages: 875 pages, biography. BIC Classification: UM. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 229 x 152 x 55. Weight in Grams: 1500. . 1992. Hardback. . . . . Books ship from the US and Ireland.
Erscheinungsdatum: 2025
Anbieter: True World of Books, Delhi, Indien
LeatherBound. Zustand: New. BOOKS ARE EXEMPT FROM IMPORT DUTIES AND TARIFFS; NO EXTRA CHARGES APPLY. LeatherBound edition. Condition: New. Reprinted from 1852 edition. Leather Binding on Spine and Corners with Golden leaf printing on spine. NO changes have been made to the original text. This is NOT a retyped or an ocr'd reprint. Illustrations, Index, if any, are included in black and white. Each page is checked manually before printing. Pages: 477 As this print on demand book is reprinted from a very old book, there could be some missing or flawed pages, but we always try to make the book as complete as possible. Fold-outs, if any, are not part of the book. If the original book was published in multiple volumes then this reprint is of only one volume, not the whole set. Sewing binding for longer life, where the book block is actually sewn (smythe sewn/section sewn) with thread before binding which results in a more durable type of binding. Pages: 477 Volume 5 Language: English.