E todd ryan (19 Ergebnisse)
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- Softcover
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- Softcover
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Verlag: Sage Publications, Inc, Thousand Oaks, CA 1999
- Softcover
- Erstausgabe
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Softcover. First Edition, First Printing. Book condition is Very Good, bound in glossy wraps. Some rubbing and edgewear to exterior. Text is clean and unmarked. ; 4to. 11"h x 8 1/2"w. Contents: "Expectations of Others' Social Value Orientations in Specific and General Populations" by Jurjen ledema and Matthijs Poppe "The Effects… of Mental Simulation on Coping With Controllable Stressful Events" by Inna D. Rivkin and Shelley E. Taylor "Effects of the Difference in the Amount of Group Preferential Information on Illusory Correlation" by Woo-Young Chun and Hoon-Koo Lee "Gone but Not Forgotten: Loyalty and Betrayal Among Ex-Members of Small Groups" by Richard L. Moreland and Jamie G. McMinn "Neosexism Among Women: The Role of Personally Experienced Social Mobility Attempts" by Francine Tougas, Rupert Brown, Ann M. Beaton, and Line St-Pierre "The Role of the Big Five Personality Dimensions in the Direction and Affective Consequences of Everyday Social Comparisons" by Bradley D. Olson and David L. Evans "The American Dream in Russia: Extrinsic Aspirations and Well-Being in Two Cultures" by Richard M. Ryan, Valery I. Chirkov, Todd D. Little, Kennon M. Sheldon, Elena Timoshina, and Edward L. Deci.
- Softcover
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Paperback. Zustand: New.
- Softcover
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- Softcover
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Zustand: New. pp. 358.
- Softcover
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- Softcover
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Zustand: New.
- Softcover
Anbieter: AHA-BUCH GmbH, Einbeck, DeutschlandAHA-BUCH GmbH
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Taschenbuch. Zustand: Neu. Neuware.
- Softcover
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Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transisto…r gate length of less than 50nm. This rapid technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.
Sprache: Englisch
Verlag: Iconoclast / D.A.P. Distributed Art Publishers, Inc. New York, NY 2004
- Hardcover
Anbieter: Specific Object / David Platzker, New York, NY, USASpecific Object / David Platzker
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EUR 157,31
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256 pp.; 28.5 x 22.2 cm.; sewn bound; black-and-white & color; edition size unknown; unsigned and unnumbered; offset-printed Exhibition catalogue published in conjunction with show held at Contemporary Arts Center, Cincinnati, March 13 - May 23, 2004. Traveled to Yerba Buena Center for the Arts, San Francisco, CA, July 17 - Octo…ber 3, 2004. Traveled to the Orange County Museum of Art, Newport Beach, CA, February 5 - May 8, 2005. Exhibition organized and catalogue edited by Aaron Rose and Christian Strike. Essays by Aaron Rose, Christian Strike, Alex Baker, Thom Collins, Jeffrey Deitch, Carlo McCormick, Arty Nelson, James E. Walmesley, and Jocko Weyland. Artists include Thomas Campbell, Cynthia Connolly, Brian Donnelly, Cheryl Dunn, Shepard Fairey, Phil Frost, Mark Gonzales, Evan Hecox, Jo Jackson, Todd James (REAS), James Jarvis, Andy Jenkins, Chris Johanson, Spike Jonze, Margaret Kilgallen, Harmony Korine, Geoff McFetridge, Barry McGee, Ryan McGinley, Ryan McGuinness, Mike Mills, Stephen Powers (ESPO), Terry Richardson, Clare E. Rojas, Rostarr, Ed Templeton, and Tobin Yelland. Includes full page artists' pages on Raymond Pettibon, Clare E. Rojas, Jo Jackson, Craig R. Stecyk III, Chris Johanson, Thomas Campbell, Ed Templeton, and Barry McGee. Includes biographies of artists as well as of artists identified as roots and influencers including Jean-Michel Basquiat, Neil Blender, Henry Chalfant, Larry Clark, R. Crumb, Glen E. Friedman, Futura, Keith Haring, Wes Humpston, Ari Marcopoulos, Raymond Pettibon, Pushead, Craig R. Stecyk III, and Andy Warhol. Also includes contributor biographies. Very Good / Fine. Small bump to bottom right corner of publication and right side of recto. Light dusting of dust jackets. Contents clean and unmarked. Due to large size and weight additional shipping charges will be required for international orders.
- Softcover
- Print-on-Demand
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Paperback. Zustand: new. Paperback. In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid…technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
- Softcover
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Paperback. Zustand: Brand New. 1st edition. 358 pages. 9.02x5.98x0.75 inches. In Stock. This item is printed on demand.
- Softcover
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Paperback / softback. Zustand: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
- Softcover
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Zustand: New. Print on Demand pp. 358.
- Softcover
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Zustand: New. PRINT ON DEMAND pp. 358.
- Softcover
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Paperback. Zustand: new. Paperback. In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid…technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
- Softcover
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Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3…D chip stacking and optical interconne.
