Verlag: Industrial and Scientific Conference Management
Anbieter: ThriftBooks-Atlanta, AUSTELL, GA, USA
Hardcover. Zustand: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.
Verlag: Industrial and Scientific Conference Management, 1965
Anbieter: BookDepart, Shepherdstown, WV, USA
Hardcover. Zustand: UsedAcceptable. Hardcover; conference held June 8-10, 1965, in Long Beach, California; surplus library copy with the usual stampings; reference number taped to spine; cloth at spine has been torn and repaired; fading and edge wear to exterior; otherwise in acceptable condition with clean text.
Anbieter: books4less (Versandantiquariat Petra Gros GmbH & Co. KG), Welling, Deutschland
gebundene Ausgabe. Zustand: Gut. 603 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 1600.
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
EUR 200,39
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. In.
Zustand: New. pp. 628.
Sprache: Englisch
Verlag: Springer Berlin Heidelberg, 2013
ISBN 10: 3662131633 ISBN 13: 9783662131633
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.
EUR 281,79
Anzahl: 2 verfügbar
In den WarenkorbPaperback. Zustand: Brand New. reprint edition. 603 pages. 9.75x8.00x1.25 inches. In Stock.
EUR 313,84
Anzahl: 1 verfügbar
In den WarenkorbPaperback. Zustand: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Anbieter: Brook Bookstore On Demand, Napoli, NA, Italien
EUR 150,28
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: new. Questo è un articolo print on demand.
Sprache: Englisch
Verlag: Springer Berlin Heidelberg, 2013
ISBN 10: 3662131633 ISBN 13: 9783662131633
Anbieter: moluna, Greven, Deutschland
EUR 162,51
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in Assembly Engineering and Elect.
Sprache: Englisch
Verlag: Springer Berlin Heidelberg Okt 2013, 2013
ISBN 10: 3662131633 ISBN 13: 9783662131633
Anbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Deutschland
Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation. 628 pp. Englisch.
Sprache: Englisch
Verlag: Springer Berlin Heidelberg, Springer Berlin Heidelberg Okt 2013, 2013
ISBN 10: 3662131633 ISBN 13: 9783662131633
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 628 pp. Englisch.
Anbieter: Majestic Books, Hounslow, Vereinigtes Königreich
EUR 266,94
Anzahl: 4 verfügbar
In den WarenkorbZustand: New. Print on Demand pp. 628 39:B&W 8 x 10 in or 254 x 203mm Perfect Bound on White w/Gloss Lam.
Anbieter: Biblios, Frankfurt am main, HESSE, Deutschland
Zustand: New. PRINT ON DEMAND pp. 628.