Helbert john n (13 Ergebnisse)

Hardcover. Zustand: Good. Little wear to boards. Content is clean with some spotting.Good DJ with little wear.

Zustand: As New. Unread book in perfect condition.

Zustand: New.

Hardcover. Zustand: Very Good. Zustand des Schutzumschlags: Very Good. First Edition. Edited by William B. Glendinning and John N. Helbert, this 1991 technical volume is a detailed reference work on the science and engineering of microlithography—the core process used to manufacture integrated circuits in microelectronics. The book explains how patterns are transferred onto semiconductor wafers using light, electron beams, and X-ray techniques. It covers both theoretical foundations and practical applications, including photoresist chemistry, optical systems, resolution limits, and process control. Topics such as positive vs. negative resists, thin-film behavior, and defect management are addressed in depth. As part of a broader materials science and process technology series, it compiles contributions from multiple experts, making it a comprehensive snapshot of lithographic technology at the dawn of the modern VLSI (Very Large Scale Integration) era. It is aimed primarily at engineers, researchers, and advanced students working in semiconductor fabrication. THIS "Review Copy" was delivered before the actual publication date of 1/15/1992. Hard cover edition with unclipped dustjacket. 649 pages. Dimensions: 6.25" by 9.5". Published by Noyes Data Corporation, NJ. 1st printing, 1991. B&W illustrations. B&W photographs. Black binding. Dustjacket defect(s): Some tears. Some wrinkling/creasing. 3.25 Pound Media Shipping Rate with Multiple Product Orders. (Min Shipping Rate 1 Pound per Order). Order More and SAVE! Genre(s): Electronics / Technology / Semiconductors / English. (B106).…

Zustand: New.

Zustand: New. pp. 672.

Zustand: New. In English.

Zustand: As New. Unread book in perfect condition.

Gebunden. Zustand: New. Redaktion: William B. GlendinningJohn Helbert is a Senior Member of the Motorola Technical Staff. He earned his doctorate in PhysicalThis handbook gives readers a close look at the entire technology of printing very high resolution and high den.

Zustand: Gut. Zustand: Gut | Seiten: 1022 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.

Hardcover. Zustand: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Buch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings-- including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely covered -- including an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook. 672 pp. Englisch.…

Buch. Zustand: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings-- including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely covered -- including an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.…