Henshall gregory (17 Ergebnisse)
- Hardcover
Anbieter: HPB-Red, Dallas, TX, USAHPB-Red
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EUR 90,45
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hardcover. Zustand: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.
- Hardcover
Anbieter: INDOO, Avenel, NJ, USAINDOO
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EUR 107,09
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Zustand: New.
Lead-Free Solder Process Development
Henshall, Gregory (EDT); Bath, Jasbir (EDT); Handwerker, Carol A. (EDT)
- Hardcover
Anbieter: GreatBookPrices, Columbia, MD, USAGreatBookPrices
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EUR 104,74
EUR 2,31 VersandVersand innerhalb von USAAnzahl: 8 verfügbar
Zustand: New.
Lead-Free Solder Process Development
Henshall, Gregory (EDT); Bath, Jasbir (EDT); Handwerker, Carol A. (EDT)
- Hardcover
Anbieter: GreatBookPrices, Columbia, MD, USAGreatBookPrices
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EUR 121,23
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Zustand: As New. Unread book in perfect condition.
- Hardcover
- Erstausgabe
Anbieter: Grand Eagle Retail, Bensenville, IL, USAGrand Eagle Retail
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EUR 132,73
Versand nach gratisVersand innerhalb von USAAnzahl: 1 verfügbar
Hardcover. Zustand: new. Hardcover. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic pro…perties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain areas on reliability. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
- Hardcover
Anbieter: PBShop.store UK, Fairford, GLOS, Vereinigtes KönigreichPBShop.store UK
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EUR 128,53
EUR 5,91 VersandVersand von Vereinigtes Königreich nach USAAnzahl: 2 verfügbar
HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.
- Hardcover
Anbieter: Rarewaves.com USA, London, LONDO, Vereinigtes KönigreichRarewaves.com USA
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 140,67
Versand nach gratisVersand von Vereinigtes Königreich nach USAAnzahl: 1 verfügbar
Hardback. Zustand: New. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of l…ocal microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
Lead-Free Solder Process Development
Henshall, Gregory (EDT); Bath, Jasbir (EDT); Handwerker, Carol A. (EDT)
- Hardcover
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes KönigreichGreatBookPricesUK
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Gebraucht - Wie neu
EUR 124,57
EUR 17,66 VersandVersand von Vereinigtes Königreich nach USAAnzahl: 2 verfügbar
Zustand: As New. Unread book in perfect condition.
Lead-Free Solder Process Development
Henshall, Gregory (EDT); Bath, Jasbir (EDT); Handwerker, Carol A. (EDT)
- Hardcover
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes KönigreichGreatBookPricesUK
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 128,52
EUR 17,66 VersandVersand von Vereinigtes Königreich nach USAAnzahl: 2 verfügbar
Zustand: New.
- Hardcover
Anbieter: THE SAINT BOOKSTORE, Southport, Vereinigtes KönigreichTHE SAINT BOOKSTORE
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EUR 133,87
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Hardback. Zustand: New. New copy - Usually dispatched within 4 working days.
- Hardcover
Anbieter: Chiron Media, Wallingford, Vereinigtes KönigreichChiron Media
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EUR 135,36
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Hardcover. Zustand: New.
- Hardcover
- Erstausgabe
Anbieter: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandKennys Bookshop and Art Galleries Ltd.
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EUR 142,61
EUR 10,50 VersandVersand von Irland nach USAAnzahl: 15 verfügbar
Zustand: New. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain area…s on reliability. Num Pages: 284 pages, Illustrations. BIC Classification: THX; TJF. Category: (P) Professional & Vocational. Dimension: 213 x 161 x 22. Weight in Grams: 580. . 2011. 1st Edition. Hardcover. . . . .
- Hardcover
Anbieter: Ubiquity Trade, Miami, FL, USAUbiquity Trade
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EUR 155,83
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Zustand: New. Brand new! Please provide a physical shipping address.
- Hardcover
Anbieter: Kennys Bookstore, Olney, MD, USAKennys Bookstore
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 176,59
EUR 9,17 VersandVersand innerhalb von USAAnzahl: 15 verfügbar
Zustand: New. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain area…s on reliability. Num Pages: 284 pages, Illustrations. BIC Classification: THX; TJF. Category: (P) Professional & Vocational. Dimension: 213 x 161 x 22. Weight in Grams: 580. . 2011. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.
- Hardcover
- Erstausgabe
Anbieter: CitiRetail, Stevenage, Vereinigtes KönigreichCitiRetail
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EUR 146,14
EUR 43,57 VersandVersand von Vereinigtes Königreich nach USAAnzahl: 1 verfügbar
Hardcover. Zustand: new. Hardcover. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic pro…perties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain areas on reliability. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
- Hardcover
Anbieter: Rarewaves.com UK, London, Vereinigtes KönigreichRarewaves.com UK
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 133,28
EUR 76,54 VersandVersand von Vereinigtes Königreich nach USAAnzahl: 1 verfügbar
Hardback. Zustand: New. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of l…ocal microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
- Hardcover
- Erstausgabe
Anbieter: AussieBookSeller, Truganina, VIC, AustralienAussieBookSeller
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 208,34
EUR 32,33 VersandVersand von Australien nach USAAnzahl: 1 verfügbar
Hardcover. Zustand: new. Hardcover. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic pro…perties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain areas on reliability. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
