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Wrappers. Zustand: Very Good. National Semiconductor Corporation, Published 1988. Wraps, 80 pp.; 28 cm; Vol. II, Summer 1988; illustrated with black-and-white circuit diagrams, schematics, charts, and graphs. In very good condition. Cream and brown paper covers with black and cream lettering on front and spine show mild shelf wear with light bumping and creasing to edges and mild soiling. Binding tight. Pages unmarked. A selection of papers delivered by the technical staff of National Semiconductor at electronics conferences including WESCON '87, ISSCC '88, IEDM '87, and the 1987 Microcontamination Conference and Exposition. Late-1980s Silicon Valley semiconductor engineering, from 16-bit microcontroller cores and bus standards to BiCMOS process technology, cleanroom alternatives, and IC packaging. Complete table of contents printed on front cover. Contents: Sixteen-Bit High-Performance Core Designed For ASIC; A Microcontroller-Based Smart Control Cell; A 33 Mbit/sec Data Synchronizing Phase-Locked-Loop Circuit; The NS32532: High Performance And Software Compatibility; A Comparison Of The Electrical Specifications Of Popular Bus Standards; Three-Dimensional Transient Simulation Of Electro-Thermal Behavior In Semiconductor Devices; Yield Diagnosis Through Interpretation Of Tester Data; Eliminating The Cleanroom: Experiences With An Open-Area SMIF Isolation Site (OASIS); Modeling The AC Impedance Of The Polysilicon-Silicon Interface; Modeling Of Delay And CrossTalk In Interconnects; A VLSI Poly Bipolar Process With 100-ps Gate Delay; An ECL Memory Cell With Separate Read And Write Ports; A High-Performance Bipolar ECL Standard Cell Library For Optimal Design Of High-Speed Bipolar LSI; Poly-Emitter Bipolar Hot-Carrier Effects In An Advanced BiCMOS Technology; A 12-ns 256K BiCMOS SRAM; A New Definition Of Package Thermal Measurement.…

Wrappers. Zustand: Very Good. National Semiconductor Corporation, Published 1989. Wraps, 82 pp.; 28 cm; Vol. IV, Winter 1989; illustrated with black-and-white circuit diagrams, schematics, charts, and photomicrographs. In very good condition. Cream and slate blue paper covers with black and cream lettering on front and spine show mild shelf wear with light bumping to edges. Binding tight. Pages unmarked. A selection of papers delivered by the technical staff of National Semiconductor at electronics conferences including MIDCON '88, Electro '88, BUSCON/88 EAST, the SAE International Congress, and the Seventh Symposium on Plasma Processing. A snapshot of late-1980s Silicon Valley semiconductor engineering, from ASIC design and embedded C programming to BiCMOS fabrication and surface-mount packaging. Complete table of contents printed on front cover. Contents: ASIC Design Verification Of Microcontroller Cores (J. Hallman); Core-Oriented Microcontrollers Provide The Flexibility And Performance Required In Today's ETR Designs (M. Aghai-Yazdy); C In Embedded Systems And The Microcontroller World (D. LaVerne); Limits Of Backplane Bus Design (P.L. Borrill); Current Developments In Futurebus (D. Hawley); New Switching Regulator's Unique Compensation Scheme Assures Design Simplicity (J. Scolio); A Systems Approach To Smart Sensors And Smart Actuator Design (M. Alby); Development Of A Helium/Chlorine-Based Polysilicon Etch Process For Use At A 1-Micron BiCMOS Gate/Emitter Poly Etch (J. McOmber); Photolithography Expert Systems At National Semiconductor (P. Leitner and R. Brown); Thermocompression Joining Of Copper To Copper For TAB (V. Sajja); Package Cracking And Moisture Absorption In Plastic Surface-Mount Components (A. Switky); Electrical Properties Of Thermally Oxidized Silicon (B. Deal); Testability Using Random Access Test Registers (C. Bui); Design For Test And The Cost Of Quality (C. Salzmann, M. Funcell and R. Taylor).…