Kada morihiro (26 Ergebnisse)

Zustand: Muy bueno. : Este libro trata sobre las interconexiones tridimensionales, centrándose en el procesamiento, los materiales y las aplicaciones avanzadas. Explora en detalle los semiconductores y otros aspectos relacionados con la tecnología de interconexión tridimensional. EAN: 9783319186740 Tipo: Libros Categoría: Tecnología Título: Three Dimensional Interconnects Autor: Kenji Takahashi| Kazuo Kondo| Morihiro Kada Idioma: eng Páginas: 408 Formato: Tapa dura Año de publicación: 2015.…

Zustand: As New. Unread book in perfect condition.

Zustand: New.

Zustand: New.

Zustand: New. In English.

Zustand: New. pp. 507.

Zustand: As New. Unread book in perfect condition.

Hardcover. Zustand: Brand New. 430 pages. 9.25x6.10x1.11 inches. In Stock.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.…

Zustand: New. In English.

Zustand: New. pp. 428.

Taschenbuch. Zustand: Neu. Three-Dimensional Integration of Semiconductors | Processing, Materials, and Applications | Kazuo Kondo (u. a.) | Taschenbuch | xix | Englisch | 2019 | Springer | EAN 9783319792552 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Paperback. Zustand: Brand New. reprint edition. 428 pages. 9.25x6.10x0.97 inches. In Stock.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.…

Buch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects. 428 pp. Englisch.…

Zustand: new. Questo è un articolo print on demand.

Zustand: new. Questo è un articolo print on demand.

Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Gives instruction on how to build three-dimensional interconnectsIntroduces materials and processing for three-dimensional packagingDiscuss many applications of three-dimensional packagingKazuo Kondo is Professor at Depart.…

Zustand: New. Print on Demand pp. 507.

Zustand: New. PRINT ON DEMAND pp. 507.

Buch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book starts with backgroundconcerning three-dimensional integration - including theirlow energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.The book covers numerous applications, includingnext generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 428 pp. Englisch.…

Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Gives instruction on how to build three-dimensional interconnectsIntroduces materials and processing for three-dimensional packagingDiscuss many applications of three-dimensional packagingKazuo Kondo is Professor at Depart.…

Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects. 428 pp. Englisch.…

Zustand: New. Print on Demand pp. 428.

Zustand: New. PRINT ON DEMAND pp. 428.

Taschenbuch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book starts with backgroundconcerning three-dimensional integration - including theirlow energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.The book covers numerous applications, includingnext generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 428 pp. Englisch.…