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Zustand: very good. Gut/Very good: Buch bzw. Schutzumschlag mit wenigen Gebrauchsspuren an Einband, Schutzumschlag oder Seiten. / Describes a book or dust jacket that does show some signs of wear on either the binding, dust jacket or pages.

Zustand: New. A brand new book in pristine condition. Showing zero signs of shelf wear, creases, or damage.

Zustand: New.

Zustand: New.

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the 'traditional' method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced.In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA.Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.…

Paperback. Zustand: Brand New. 240 pages. 9.20x6.10x0.51 inches. In Stock.

Zustand: As New. Unread book in perfect condition.

Zustand: As New. Unread book in perfect condition.

hardcover. Zustand: Befriedigend. 208 Seiten; ehem. BÃ 1/4 chereiexemplar, Artikel stammt aus Nichtraucherhaushalt! X10617 Sprache: Deutsch Gewicht in Gramm: 500.

hardcover. Zustand: Sehr gut. 208 Seiten 9783312010011 Wir verkaufen nur, was wir auch selbst lesen würden. Sprache: Deutsch Gewicht in Gramm: 278.

Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides solutions to several common reliability issues in microsystem packagingTeaches the reader methods to understand and predict failure mechanisms at interfaces between dissimilar materialsCombines thermodynamic-diffusion kinetic model.…

Gebunden. Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides solutions to several common reliability issues in microsystem packagingTeaches the reader methods to understand and predict failure mechanisms at interfaces between dissimilar materialsCombines thermodynamic-diffusion kinetic model.…