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Hardcover. Octavo, viii, 498 pages. In Good plus condition with a Good dust jacket in Good slipcase. Slipcase in red paper; light shelf wear. Spine is blue and cream with white and black print. Dust jacket has light edge wear, toning to spine. Price unclipped: "$15.00". Boards in blue cloth; slight wear to spine caps, light shelf wear. Illustrated: b&w frontispiece portrait and plates (photographs). NOTE: Shelved in Netdesk Column Z. 1408834. FP New Rockville Stock.…

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Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Solder Joint Reliability Prediction for Multiple Environmentswill provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space,and automotive industries.…

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Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - Solder Joint Reliability Prediction for Multiple Environmentswill provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space,and automotive industries.…

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Taschenbuch. Zustand: Neu. Solder Joint Reliability Prediction for Multiple Environments | Andrew E. Perkins (u. a.) | Taschenbuch | xvi | Englisch | 2010 | Springer | EAN 9781441946348 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

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Gebunden. Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a comprehensive summary of current literature on lead-containing ceramic area array electronic package solder joining reliabilityDevelops useful and easy-to-use tools for predicting solder joint fatigue life under thermal cycling and powe.…

Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a comprehensive summary of current literature on lead-containing ceramic area array electronic package solder joining reliabilityDevelops useful and easy-to-use tools for predicting solder joint fatigue life under thermal cycling and powe.…

Zustand: New. Print on Demand pp. 212 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.

Buch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 212 pp. Englisch.…