Srikrishnan kris (17 Ergebnisse)
Handbook of Semiconductor Interconnection Technology, 2nd Edition (Original Price £ 153.00)
Geraldine Cogin Shwartz, Geraldine C. Schwartz, Kris V. Srikrishnan
- Softcover
- Internationale Ausgabe
Anbieter: Basi6 International, Irving, TX, USABasi6 International
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenInternationale AusgabeZustand: Neu
EUR 82,70
Versand gratisVersand innerhalb von USAAnzahl: 1 verfügbar
Zustand: Brand New. New.SoftCover International edition. Different ISBN and Cover image but contents are same as US edition.Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Handbook of Semiconductor Interconnection Technology
Shwartz, Geraldine Cogin; Schwartz, Geraldine C. [Editor]; Srikrishnan, Kris V. [Editor];
- Hardcover
Anbieter: BennettBooksLtd, Los Angeles, CA, USABennettBooksLtd
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EUR 192,02
EUR 5,98 VersandVersand innerhalb von USAAnzahl: 1 verfügbar
Hardcover. Zustand: New. In shrink wrap. Looks like an interesting title.
- Hardcover
Anbieter: PBShop.store UK, Fairford, GLOS, Vereinigtes KönigreichPBShop.store UK
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EUR 290,22
EUR 7,87 VersandVersand von Vereinigtes Königreich nach USAAnzahl: 1 verfügbar
HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.
- Hardcover
Anbieter: GreatBookPrices, Columbia, MD, USAGreatBookPrices
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EUR 303,90
EUR 2,27 VersandVersand innerhalb von USAAnzahl: 1 verfügbar
Zustand: New.
- Hardcover
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes KönigreichGreatBookPricesUK
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EUR 290,21
EUR 17,46 VersandVersand von Vereinigtes Königreich nach USAAnzahl: 1 verfügbar
Zustand: New.
- Hardcover
Anbieter: GreatBookPrices, Columbia, MD, USAGreatBookPrices
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EUR 317,53
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Zustand: As New. Unread book in perfect condition.
- Hardcover
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes KönigreichGreatBookPricesUK
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EUR 315,37
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Zustand: As New. Unread book in perfect condition.
- Hardcover
Anbieter: Grand Eagle Retail, Bensenville, IL, USAGrand Eagle Retail
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EUR 362,89
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Hardcover. Zustand: new. Hardcover. First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and…many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.What's in this Edition: Detailed discussion of electrochemical equipment for plating copper Information on tools used for evaporation, chemical vapor deposition, and plasma processes Emphasis on measurement of mechanical and thermal properties of insulators Methods for characterizing porous dielectric thin films Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides Process schemes based on the increased need for borderless contact gates and source/drain Expanded discussion on choices for low-dielectric insulators Concentration on electroplated copper, especially morphology of plated films and their properties Developments in thin film liners and barriers Expanded material on copper reliability Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
- Hardcover
Anbieter: Books Puddle, New York, NY, USABooks Puddle
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EUR 361,54
EUR 3,44 VersandVersand innerhalb von USAAnzahl: 3 verfügbar
Zustand: New. pp. 536 2nd Edition.
- Hardcover
Anbieter: moluna, Greven, Deutschlandmoluna
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EUR 313,20
EUR 48,99 VersandVersand von Deutschland nach USAAnzahl: 1 verfügbar
Zustand: New. Geraldine C. Schwartz, Geraldine Cogin Shwartz, Kris V. SrikrishnanFirst introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated .
Handbook of Semiconductor Interconnection Technology, Second Edition
Schwartz, Geraldine C. (Edited by)/ Srikrishnan, Kris V. (Edited by)
- Hardcover
Anbieter: Revaluation Books, Exeter, Vereinigtes KönigreichRevaluation Books
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EUR 367,97
EUR 17,46 VersandVersand von Vereinigtes Königreich nach USAAnzahl: 1 verfügbar
Hardcover. Zustand: Brand New. 2nd edition. 520 pages. 10.00x6.75x1.00 inches. In Stock.
- Hardcover
Anbieter: Biblios, frankfurt am main, HESSE, DeutschlandBiblios
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EUR 387,57
EUR 9,95 VersandVersand von Deutschland nach USAAnzahl: 3 verfügbar
Zustand: New. pp. 536.
Handbook of Semiconductor Interconnection Technology
Schwartz, Geraldine Cogin; Srikrishnan, Kris V.; Bross, Arthur. Ed(s): Schwartz, Geraldine Cogin; Srikrishnan, Kris V.
- Hardcover
Anbieter: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandKennys Bookshop and Art Galleries Ltd.
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 403,73
EUR 9,50 VersandVersand von Irland nach USAAnzahl: 10 verfügbar
Zustand: New. Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Editor(s): Schwartz…, Geraldine Cogin; Srikrishnan, Kris V. Num Pages: 536 pages, 227 black & white illustrations, 12 black & white tables, 1 black & white halftones. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 254 x 178 x 30. Weight in Grams: 1133. . 2006. 2 Rev ed. Hardback. . . . .
Handbook of Semiconductor Interconnection Technology, Second Edition
Schwartz, Geraldine C. (Edited by)/ Srikrishnan, Kris V. (Edited by)
- Hardcover
Anbieter: Revaluation Books, Exeter, Vereinigtes KönigreichRevaluation Books
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 455,95
EUR 17,46 VersandVersand von Vereinigtes Königreich nach USAAnzahl: 1 verfügbar
Hardcover. Zustand: Brand New. 2nd edition. 520 pages. 10.00x6.75x1.00 inches. In Stock.
Handbook of Semiconductor Interconnection Technology
Schwartz, Geraldine Cogin; Srikrishnan, Kris V.; Bross, Arthur. Ed(s): Schwartz, Geraldine Cogin; Srikrishnan, Kris V.
- Hardcover
Anbieter: Kennys Bookstore, Olney, MD, USAKennys Bookstore
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 496,67
EUR 9,04 VersandVersand innerhalb von USAAnzahl: 10 verfügbar
Zustand: New. Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Editor(s): Schwartz…, Geraldine Cogin; Srikrishnan, Kris V. Num Pages: 536 pages, 227 black & white illustrations, 12 black & white tables, 1 black & white halftones. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 254 x 178 x 30. Weight in Grams: 1133. . 2006. 2 Rev ed. Hardback. . . . . Books ship from the US and Ireland.
- Hardcover
Anbieter: AussieBookSeller, Truganina, VIC, AustralienAussieBookSeller
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 574,85
EUR 31,86 VersandVersand von Australien nach USAAnzahl: 1 verfügbar
Hardcover. Zustand: new. Hardcover. First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and…many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.What's in this Edition: Detailed discussion of electrochemical equipment for plating copper Information on tools used for evaporation, chemical vapor deposition, and plasma processes Emphasis on measurement of mechanical and thermal properties of insulators Methods for characterizing porous dielectric thin films Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides Process schemes based on the increased need for borderless contact gates and source/drain Expanded discussion on choices for low-dielectric insulators Concentration on electroplated copper, especially morphology of plated films and their properties Developments in thin film liners and barriers Expanded material on copper reliability Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
- Hardcover
- Print-on-Demand
Anbieter: Majestic Books, Hounslow, Vereinigtes KönigreichMajestic Books
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EUR 336,94
EUR 7,56 VersandVersand von Vereinigtes Königreich nach USAAnzahl: 3 verfügbar
Zustand: New. pp. 536 Illus. This item is printed on demand.
