Hardcover. Zustand: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.
Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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In den WarenkorbZustand: New. In English.
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Zustand: New. Softcover reprint of the original 2nd ed. 2019 edition NO-PA16APR2015-KAP.
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In den WarenkorbZustand: As New. Unread book in perfect condition.
Zustand: New. 2nd ed. 2019 edition NO-PA16APR2015-KAP.
Zustand: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Zustand: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Zustand: New. pp. 770 1st Edition.
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hardcover. Zustand: Very Good.
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In den WarenkorbHardcover. Zustand: Brand New. 2nd edition. 282 pages. 9.25x6.25x0.25 inches. In Stock.
Softcover. Zustand: Fine. Abnutzung / Risse - leicht; Gebrochener Buchrücken / Seiten oder Softcover umgeknickt; Vergilbt / ausgeblichen. MOS technologies now account for more than 70 % of integrated circuits (ICs) and this percentage is expected to increase.This book provides an essential introduction to MOS ICs. It describes clearly their fundamental operating principles and presents substantial insight into various design, implementation and application aspects. In contrast to other works on this topic, the book explores all associated disciplines, including physics, design, technology and packaging.Enriched by in-depth exercises and carefully structured, the book is well suited as a textbook.Harry Veendrick joined a Philips research team in Eindhoven in 1977, where he has been acitvely involved for years in the training of engineers. His principal interest is the development of digital MOS circuits, with recent emphasis on ASICs.
Zustand: New.
Sprache: Englisch
Verlag: Springer International Publishing, 2018
ISBN 10: 3319760955 ISBN 13: 9783319760957
Anbieter: moluna, Greven, Deutschland
EUR 64,08
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New. Explains integrated circuit design, implementation, fabrication and application in a well-balanced and detailed fashionTargets any reader who is curious about chips: from individuals with only a little to almost no technical background, to p.
Sprache: Englisch
Verlag: Springer International Publishing, Springer International Publishing, 2019
ISBN 10: 3030094014 ISBN 13: 9783030094010
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides readers with a broad overview of integrated circuits, also generally referred to as micro-electronics. The presentation is designed to be accessible to readers with limited, technical knowledge and coverage includes key aspects of integrated circuit design, implementation, fabrication and application. The author complements his discussion with a large number of diagrams and photographs, in order to reinforce the explanations. The book is divided into two parts, the first of which is specifically developed for people with almost no or little technical knowledge. It presents an overview of the electronic evolution and discusses the similarity between a chip floor plan and a city plan, using metaphors to help explain concepts. It includes a summary of the chip development cycle, some basic definitions and a variety of applications that use integrated circuits. The second part digs deeper into the details and is perfectly suited for professionals working in one of thesemiconductor disciplines who want to broaden their semiconductor horizon.
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides readers with a broad overview of integrated circuits, also generally referred to as micro-electronics. The presentation is designed to be accessible to readers with limited, technical knowledge and coverage includes key aspects of integrated circuit design, implementation, fabrication and application. The author complements his discussion with a large number of diagrams and photographs, in order to reinforce the explanations. The book is divided into two parts, the first of which is specifically developed for people with almost no or little technical knowledge. It presents an overview of the electronic evolution and discusses the similarity between a chip floor plan and a city plan, using metaphors to help explain concepts. It includes a summary of the chip development cycle, some basic definitions and a variety of applications that use integrated circuits. The second part digs deeper into the details and is perfectly suited for professionals working in one of thesemiconductor disciplines who want to broaden their semiconductor horizon.