ISBN: 9780471466093 - advanced electronic packaging (ieee press series on microelectronic systems) (21 Ergebnisse)

Hardcover. Zustand: Very Good. 2. It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting.

Hardback. Zustand: Good. This book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed.W.D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses.…

Hardback. Zustand: Good. This book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed.W.D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses.…

Hardcover. Zustand: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.

hardcover. Zustand: new.

hardcover. Zustand: New. In shrink wrap. Looks like an interesting title.

Zustand: New.

HRD. Zustand: New. New Book. Shipped from UK. Established seller since 2000.

Zustand: New.

Zustand: new.

Zustand: As New. Unread book in perfect condition.

Zustand: As New. Unread book in perfect condition.

Zustand: New. pp. xxvi + 812 Illus.

Zustand: New. This book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed.W.D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses. Editor(s): Ulrich, Richard K.; Brown, William D. Series: IEEE Press Series on Microelectronic Systems. Num Pages: 840 pages, illustrations. BIC Classification: TJ. Category: (P) Professional & Vocational. Dimension: 190 x 264 x 51. Weight in Grams: 1728. . 2006. 2nd Edition. Hardcover. . . . . …

Gebunden. Zustand: New. .a very nice reference. (IEEE Circuits & Devices Magazine, November/December 2006) .offers a broad perspective on electronic packaging. (Advanced Packaging Online, August 11, 2006) .an extremely thorough engineering textbook and an invaluable refer.

Zustand: New. In English.

Zustand: New. pp. xxvi + 812 2nd Edition.

Hardcover. Zustand: Brand New. 2nd edition. 812 pages. 10.25x7.25x1.75 inches. In Stock.

Zustand: New. This book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed.W.D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses. Editor(s): Ulrich, Richard K.; Brown, William D. Series: IEEE Press Series on Microelectronic Systems. Num Pages: 840 pages, illustrations. BIC Classification: TJ. Category: (P) Professional & Vocational. Dimension: 190 x 264 x 51. Weight in Grams: 1728. . 2006. 2nd Edition. Hardcover. . . . . Books ship from the US and Ireland. …

Buch. Zustand: Neu. Neuware - Advanced Electronic Packaging, Second Edition reflects the changes in the electronic packaging industry, as well as feedback from students, engineers, and educators since the publication of the First Edition in 1999. Like the First Edition, each chapter is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout.Readers familiar with the First Edition will note several key changes. For example, organic and ceramic substrates are now covered in separate chapters. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly. In addition, readers have access to the latest information and findings in such topics as:\* Packaging materials and applications\* Modeling and simulations\* Analytical techniques for materials\* MEMS packaging\* Fabrication technologies and package design\* Reliability\* Electrical, mechanical, and thermal considerations\* Three-dimensional packagingAll the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. Examples illustrate real-world applications, which are then reinforced by the extensive use of exercises to enable readers themselves to place their newfound knowledge into practice. In addition, references are provided that guide readers to more in-depth information and primary resources in specialized topics.Fully updated, this comprehensive reference remains the preeminent graduate-level textbook in its field as well as an essential reference for engineers and scientists.…

Zustand: New. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 6-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.…