ISBN: 9780792395447 - simulation techniques and solutions for mixed-signal coupling in integrated circuits (the springer international series in engineering and computer science, band 302) (17 Ergebnisse)

Zustand: very_good. Fast Free Shipping â" Very Good condition book with a firm cover and clean pages. Shows normal use and some light wear or limited notes markings. A solid, nice copy to enjoy.

Hardcover. Zustand: Like New. Pristine. Fine in every way. Looks unread.

Zustand: good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear.

Zustand: Gut. Zustand: Gut | Seiten: 280 | Sprache: Englisch | Produktart: Bücher | FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions.

Zustand: New. This text addresses two major issues of the mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques and suggests possible solutions. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 280 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 235 x 155 x 22. Weight in Grams: 625. . 1994. Hardback. . . . .…

Zustand: New.

Zustand: New.

Gebunden. Zustand: New. List of Figures. List of Tables. Preface. 1. Introduction. 2. Sources of Noise and Methods of Coupling. 3. Semiconductor Device Simulation. 4. Simplified Substrate Modeling and Rapid Simulation. 5. Mesh Generation. 6. Substrate Modeling in Heavily-Doped.

Zustand: New. pp. xxiii + 280 Index.

Hardcover. Zustand: Brand New. 1995 edition. 304 pages. 9.75x6.50x0.75 inches. In Stock.

Zustand: New. This text addresses two major issues of the mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques and suggests possible solutions. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 280 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 235 x 155 x 22. Weight in Grams: 625. . 1994. Hardback. . . . . Books ship from the US and Ireland.…

Buch. Zustand: Neu. Neuware - 1 Introduction.- 2 Sources of Noise and Methods of Coupling.- 2.1 Semiconductor Device Noise and Phenomena.- 2.2 Noise from Switching Voltage and Current.- 2.3 Inductive Coupling.- 2.4 Capacitive Coupling.- 2.5 Substrate Coupling.- 2.6 Summary.- 3 Semiconductor Device Simulation.- 3.1 Significance.- 3.2 Basic Equations.- 3.3 Boundary Conditions.- 3.4 Models of Physical Parameters.- 3.5 Spatial Discretization.- 3.6 Solution Methods.- 3.7 A Representative Example.- 3.8 Summary.- 4 Simplified Substrate Modeling and Rapid Simulation.- 4.1 Simplified Equation.- 4.2 Spatial Discretization.- 4.3 Boundary Conditions.- 4.4 Solution Methods.- 4.5 Asymptotic Waveform Evaluation (AWE).- 4.6 Substrate AWE Macromodels.- 4.7 Transient Simulation of AWE Macromodels.- 4.8 Substrate DC Macromodels.- 4.9 Matrix Solution.- 4.10 Results.- 4.11 Summary.- 5 Mesh Generation.- 5.1 Adaptive Mesh Refinement.- 5.2 A Priori Mesh Refinement.- 5.3 Summary.- 6 Substrate Modeling in Heavily-Doped Bulk Processes.- 6.1 Motivation.- 6.2 Single Node Substrate Model.- 6.3 Modified Single Node Substrate Model.- 6.4 Summary.- 7 Substrate Resistance Extraction for Large Circuits.- 7.1 Nested Macromodeling.- 7.2 Interpolated Macromodeling.- 7.3 Summary.- 8 Modeling Chip/Package Power Distribution.- 8.1 Effect of Power Bus Structure on Noise coupling.- 8.2 Summary.- 9 Controlling Substrate Coupling in Heavily-Doped Bulk Processes.- 9.1 Characterization of noise coupling concepts.- 9.2 P+ Bulk Wafer Characterization.- 9.3 Effect of Substrate contact placement on coupled noise.- 9.4 Effect of Package Inductance on Substrate noise.- 9.5 Noise Coupling Control Techniques.- 9.6 Summary.- 10 Controlling Substrate Coupling in Bulk P- Wafers.- 10.1 Bulk P- Wafer Characteristics.- 10.2 Substrate Attenuation Structures.-10.3 Summary.- 11 Chip/Package Shielding and Good Circuit Design Practice.- 11.1 Far Field Radiated Emissions.- 11.2 Effect of Chip Signal Isolation/Shielding Techniques on Noise.- 11.3 Effect of Packaging on Noise.- 11.4 Effect of Card Layout and Referencing on Noise.- 11.5 Effect of Circuit Topology on Noise.- 11.6 Summary.- 12 A Design Example.- 12.1 Design of a Mixed-Signal IC.- 12.2 Summary.- Appendices.- A Mesh Moments.- B Convergence Behaviour of Iterative Methods.…

Zustand: As New. Unread book in perfect condition.

Hardcover. Zustand: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Zustand: As New. Unread book in perfect condition.

Zustand: New. Print on Demand pp. xxiii + 280 Figures.

Zustand: New. PRINT ON DEMAND pp. xxiii + 280.