Verwandte Artikel zu Simulation Techniques and Solutions for Mixed-Signal...
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits: 302 (The Springer International Series in Engineering and Computer Science) - Hardcover
Inhaltsangabe
The goal ofputting "systems on a chip" has been a difficultchallenge that is only recently beginning to be met. Since the world is "analog"putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir- cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig- ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign- ers who have to deal with the complexityofmixed-signal coupling is the lackofveri- fication techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech- niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions.
Die Inhaltsangabe kann sich auf eine andere Ausgabe dieses Titels beziehen.
Reseña del editor
The goal ofputting "systems on a chip" has been a difficultchallenge that is only recently beginning to be met. Since the world is "analog"putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir- cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig- ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign- ers who have to deal with the complexityofmixed-signal coupling is the lackofveri- fication techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech- niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions.
„Über diesen Titel“ kann sich auf eine andere Ausgabe dieses Titels beziehen.
Neu kaufen
Diesen Artikel anzeigen
EUR 136,16
Gratis für den Versand innerhalb von/der Deutschland
Versandziele, Kosten & Dauer
Suchergebnisse für Simulation Techniques and Solutions for Mixed-Signal...
Beispielbild für diese ISBN
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
Anbieter: ThriftBooks-Atlanta, AUSTELL, GA, USA
Verkäuferbewertung 5 von 5 Sternen
Hardcover. Zustand: As New. No Jacket. Pages are clean and are not marred by notes or folds of any kind. ~ ThriftBooks: Read More, Spend Less. Bestandsnummer des Verkäufers G0792395441I2N00
Anzahl: 1 verfügbar
Foto des Verkäufers
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits: 302 (The Springer International Series in Engineering and Computer Science, 302)
Anbieter: WeBuyBooks, Rossendale, LANCS, Vereinigtes Königreich
Verkäuferbewertung 5 von 5 Sternen
Zustand: Good. Most items will be dispatched the same or the next working day. A copy that has been read but remains in clean condition. All of the pages are intact and the cover is intact and the spine may show signs of wear. The book may have minor markings which are not specifically mentioned. Ex library copy with usual stamps & stickers. Bestandsnummer des Verkäufers wbs9444601604
Anzahl: 1 verfügbar
Beispielbild für diese ISBN
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits (The Springer International Series in Engineering and Computer Science)
Anbieter: Abyssbooks, Crestone, CO, USA
Verkäuferbewertung 4 von 5 Sternen
Hardcover. Zustand: Like New. Pristine. Fine in every way. Looks unread. Bestandsnummer des Verkäufers B8-FQ8F-LQP2
Anzahl: 1 verfügbar
Beispielbild für diese ISBN
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
Anbieter: Buchpark, Trebbin, Deutschland
Verkäuferbewertung 5 von 5 Sternen
Zustand: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher. Bestandsnummer des Verkäufers 3035540/3
Anzahl: 1 verfügbar
Beispielbild für diese ISBN
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits (The Springer International Series in Engineering and Computer Science, 302)
Anbieter: HPB-Red, Dallas, TX, USA
Verkäuferbewertung 5 von 5 Sternen
hardcover. Zustand: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! Bestandsnummer des Verkäufers S_426036400
Anzahl: 1 verfügbar
Foto des Verkäufers
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
Print-on-DemandAnbieter: moluna, Greven, Deutschland
Verkäuferbewertung 4 von 5 Sternen
Gebunden. Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. List of Figures. List of Tables. Preface. 1. Introduction. 2. Sources of Noise and Methods of Coupling. 3. Semiconductor Device Simulation. 4. Simplified Substrate Modeling and Rapid Simulation. 5. Mesh Generation. 6. Substrate Modeling in Heavily-Doped. Bestandsnummer des Verkäufers 5971574
Anzahl: Mehr als 20 verfügbar
Foto des Verkäufers
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
Verlag:
Springer US, Springer New York Dez 1994, 1994
ISBN 10: 0792395441
ISBN 13: 9780792395447
Neu
Hardcover
Anbieter: buchversandmimpf2000, Emtmannsberg, BAYE, Deutschland
Verkäuferbewertung 5 von 5 Sternen
Buch. Zustand: Neu. Neuware -FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 308 pp. Englisch. Bestandsnummer des Verkäufers 9780792395447
Anzahl: 2 verfügbar
Foto des Verkäufers
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
Print-on-DemandAnbieter: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Deutschland
Verkäuferbewertung 5 von 5 Sternen
Buch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The goal ofputting 'systems on a chip' has been a difficultchallenge that is only recently beginning to be met. Since the world is 'analog'putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign ers who have to deal with the complexityofmixed-signal coupling is the lackofveri fication techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions. 308 pp. Englisch. Bestandsnummer des Verkäufers 9780792395447
Anzahl: 2 verfügbar
Foto des Verkäufers
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
Verlag:
Springer US, Springer New York, 1994
ISBN 10: 0792395441
ISBN 13: 9780792395447
Neu
Hardcover
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Verkäuferbewertung 5 von 5 Sternen
Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The goal ofputting 'systems on a chip' has been a difficultchallenge that is only recently beginning to be met. Since the world is 'analog'putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign ers who have to deal with the complexityofmixed-signal coupling is the lackofveri fication techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions. Bestandsnummer des Verkäufers 9780792395447
Anzahl: 1 verfügbar
Beispielbild für diese ISBN
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits (The Springer International Series in Engineering and Computer Science, 302)
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
Verkäuferbewertung 5 von 5 Sternen
Zustand: New. In. Bestandsnummer des Verkäufers ria9780792395447_new
Anzahl: Mehr als 20 verfügbar