Isbn: 9783030252007 - advanced thermal stress analysis of smart materials and structures (structural integrity, 10, band 10) (16 Ergebnisse)

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Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. The book contains six chapters and starts with abrief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introducedthrough reviewing the methods for solving non-Fourier heat conduction theories and bypresenting transient heat transport in representative homogeneousand advanced heterogeneous materials. Thebook provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry.A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends withcoupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authorspropose directions for future research on the topic of multiphysical analysis of smart materials.…

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Buch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware - This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. The book contains six chapters and starts with abrief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introducedthrough reviewing the methods for solving non-Fourier heat conduction theories and bypresenting transient heat transport in representative homogeneousand advanced heterogeneous materials. Thebook provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry.A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends withcoupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authorspropose directions for future research on the topic of multiphysical analysis of smart materials. 316 pp. Englisch.…

Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. A first monograph on thermal stress analysis based on&nbspnon-Fourier heat conduction theoriesIncludes applications of non-Fourier heat conduction in thermal stress analysis of smart materials and structuresSummarizies non-Fourier heat co.…

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Buch. Zustand: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures.The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry.A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 316 pp. Englisch.…