Anbieter: Zoom Books East, Glendale Heights, IL, USA
Zustand: good. Book is in good condition and may include underlining highlighting and minimal wear. The book can also include "From the library of" labels. May not contain miscellaneous items toys, dvds, etc. . We offer 100% money back guarantee and 24 7 customer service.
Anbieter: ThriftBooks-Dallas, Dallas, TX, USA
Paperback. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
Anbieter: ThriftBooks-Atlanta, AUSTELL, GA, USA
Paperback. Zustand: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
Softcover. Zustand: Fair. Kalmbach Books Fine Scale Modeler Books - Military Vehicles & Tanks (Kalmbach Books) Basics of Ship Modeling - The Illustrated Guide (Fair+)Manufacturer: Kalmbach BooksProduct Line: Fine Scale Modeler Books - Military Vehicles & Tanks (Kalmbach Books)Type: SoftcoverCode: KAL12220Copyright Date: 2000Author: Mike AshleyPage Count: 112Please review the condition and any condition notes for the exact condition of this item. All pictures are stock photos. The condition of the item you will receive is Fair+. Our grading system is explained in the terms of sale section of our bookseller page. Please feel free to contact us with any questions. Product Description:Launch better ship models than ever before with expert Mike Ashelyâs advice, including how to remove seams, improve hull and deck assemblies, and even how to paint and weather your ships.
Paperback. Zustand: Good.
Softcover. Zustand: Very Good. 2005 Softcover Edition. Light handling wear to cover. Pages unmarked.
Zustand: very_good. Gently read. May have name of previous ownership, or ex-library edition. Binding tight; spine straight and smooth, with no creasing; covers clean and crisp. Minimal signs of handling or shelving. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item for full refund. Ships USPS Media Mail.
Sprache: Englisch
Verlag: Kalmbach Books, Iola, WI
Anbieter: J. F. Whyland Books, Jeffersonville, IN, USA
Erstausgabe
Wraps. Zustand: Fine. No Jacket. First Edition. Fully illustrated. Fine in illustrated wraps as issued. BX46.
Anbieter: Lucky's Textbooks, Dallas, TX, USA
EUR 53,41
Anzahl: Mehr als 20 verfügbar
In den WarenkorbZustand: New.
Anbieter: Phatpocket Limited, Waltham Abbey, HERTS, Vereinigtes Königreich
EUR 56,41
Anzahl: 1 verfügbar
In den WarenkorbZustand: Like New. Used - Like New. Book is new and unread but may have minor shelf wear. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.
Anbieter: SHIMEDIA, Orient, NY, USA
Zustand: New. Satisfaction Guaranteed or your money back.
Anbieter: Toscana Books, AUSTIN, TX, USA
Paperback. Zustand: new. Excellent Condition.Excels in customer satisfaction, prompt replies, and quality checks.
Anbieter: BennettBooksLtd, San Diego, NV, USA
Paperback. Zustand: New. In shrink wrap. Looks like an interesting title!
Sprache: Englisch
Verlag: VDM Verlag Dr. Müller, VDM Verlag Dr. Müller E.K., 2008
ISBN 10: 3639001664 ISBN 13: 9783639001662
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Taschenbuch. Zustand: Neu. Neuware - Chemical Mechanical Planarization (CMP) is one of the key enabling technologies for modern IC fabrication. However, mainly due to the high complexities coming from various interactions among mechanical reactions and chemical reactions, its fundamental working mechanism is still not fully understood. This book summarizes key CMP applications and challenges in modern IC fabrication, and provides a comprehensive physical CMP process model that can be applied for process characterization, process optimization, consumable development, and layout design for manufacturing (DFM). The model has been built from an abrasive scale to a chip scale, focusing on practical application for DFM while also considering CMP process conditions as key input parameters. Also included are examples of a computer model application for pattern dependent variation in shallow trench isolation CMP and the model verification with specially designed test chip. The model should help CMP professionals, DFM engineers and students of IC fabrication obtain a fundamental understanding of CMP process and characterize and improve a process through real application.
Zustand: new.