Quality conformance qualification microelectronic (22 Ergebnisse)
- Hardcover
Anbieter: Bay State Book Company, North Smithfield, RI, USABay State Book Company
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Gebraucht - Gut
EUR 112,90
Versand nach gratisVersand innerhalb von USAAnzahl: 1 verfügbar
Zustand: very_good.
- Hardcover
Anbieter: GreatBookPrices, Columbia, MD, USAGreatBookPrices
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 143,27
EUR 2,31 VersandVersand innerhalb von USAAnzahl: Mehr als 20 verfügbar
Zustand: New.
- Hardcover
Anbieter: INDOO, Avenel, NJ, USAINDOO
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 145,66
Versand nach gratisVersand innerhalb von USAAnzahl: Mehr als 20 verfügbar
Zustand: New.
- Hardcover
Anbieter: PBShop.store UK, Fairford, GLOS, Vereinigtes KönigreichPBShop.store UK
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 152,18
EUR 6,81 VersandVersand von Vereinigtes Königreich nach USAAnzahl: 15 verfügbar
PAP. Zustand: New. New Book. Shipped from UK. Established seller since 2000.
- Hardcover
Anbieter: Brook Bookstore On Demand, Napoli, NA, ItalienBrook Bookstore On Demand
Verkäufer/-in kontaktierenVerkäufer/-in mit 3 SternenZustand: Neu
EUR 151,43
EUR 8,00 VersandVersand von Italien nach USAAnzahl: Mehr als 20 verfügbar
Zustand: new.
- Hardcover
Anbieter: GreatBookPrices, Columbia, MD, USAGreatBookPrices
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Gebraucht - Wie neu
EUR 165,77
EUR 2,31 VersandVersand innerhalb von USAAnzahl: Mehr als 20 verfügbar
Zustand: As New. Unread book in perfect condition.
- Hardcover
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes KönigreichGreatBookPricesUK
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 152,17
EUR 17,39 VersandVersand von Vereinigtes Königreich nach USAAnzahl: Mehr als 20 verfügbar
Zustand: New.
- Hardcover
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes KönigreichRia Christie Collections
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 165,03
EUR 13,89 VersandVersand von Vereinigtes Königreich nach USAAnzahl: Mehr als 20 verfügbar
Zustand: New. In.
- Softcover
- Erstausgabe
Anbieter: Grand Eagle Retail, Bensenville, IL, USAGrand Eagle Retail
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 181,17
Versand nach gratisVersand innerhalb von USAAnzahl: 1 verfügbar
Paperback. Zustand: new. Paperback. All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectiv…ely address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful. * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate.wire and wire, tape automated,and flip-chip bonding.element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp. All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost--effective products should know that the paradigm has shifted. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
- Hardcover
Anbieter: GreatBookPricesUK, Woodford Green, Vereinigtes KönigreichGreatBookPricesUK
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Gebraucht - Wie neu
EUR 165,77
EUR 17,39 VersandVersand von Vereinigtes Königreich nach USAAnzahl: Mehr als 20 verfügbar
Zustand: As New. Unread book in perfect condition.
- Hardcover
Anbieter: Majestic Books, Hounslow, , Vereinigtes KönigreichMajestic Books
Verkäufer/-in kontaktierenVerkäufer/-in mit 4 SternenZustand: Neu
EUR 203,66
EUR 7,54 VersandVersand von Vereinigtes Königreich nach USAAnzahl: 3 verfügbar
Zustand: New. pp. 461.
- Hardcover
Anbieter: Ubiquity Trade, Miami, FL, USAUbiquity Trade
Verkäufer/-in kontaktierenVerkäufer/-in mit 4 SternenZustand: Neu
EUR 210,68
EUR 2,63 VersandVersand innerhalb von USAAnzahl: Mehr als 20 verfügbar
Zustand: New. Brand new! Please provide a physical shipping address.
- Hardcover
- Erstausgabe
Anbieter: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandKennys Bookshop and Art Galleries Ltd.
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 196,02
EUR 10,50 VersandVersand von Irland nach USAAnzahl: Mehr als 20 verfügbar
Zustand: New. All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost--effective products should know that the paradigm has shifted. Editor(s): Pecht, Michael; Dasgupta, Abhijit; Evans, John W.; Evans, Jillian Y. Num Pages: 462 pages, Illustrations. BIC Classific…ation: KJMV5; TGPQ; TGPR; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 243 x 163 x 29. Weight in Grams: 888. . 1994. 1st Edition. Hardcover. . . . .
- Softcover
- Erstausgabe
Anbieter: CitiRetail, Stevenage, Vereinigtes KönigreichCitiRetail
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 176,71
EUR 42,89 VersandVersand von Vereinigtes Königreich nach USAAnzahl: 1 verfügbar
Paperback. Zustand: new. Paperback. All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectiv…ely address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful. * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate.wire and wire, tape automated,and flip-chip bonding.element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp. All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost--effective products should know that the paradigm has shifte Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
- Hardcover
Anbieter: Books Puddle, New York, NY, USABooks Puddle
Verkäufer/-in kontaktierenVerkäufer/-in mit 4 SternenZustand: Neu
EUR 223,53
EUR 3,49 VersandVersand innerhalb von USAAnzahl: 3 verfügbar
Zustand: New. pp. 461.
Quality Conformance and Qualification of Microelec Microelectronic Packages & Interconnects
Pecht, Michael/ Dasgupta, Abhijit/ Evans, John W. (Contributor)
- Softcover
Anbieter: Revaluation Books, Exeter, , Vereinigtes KönigreichRevaluation Books
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 239,67
EUR 14,49 VersandVersand von Vereinigtes Königreich nach USAAnzahl: 2 verfügbar
Paperback. Zustand: Brand New. 461 pages. 9.75x6.75x1.25 inches. In Stock.
- Hardcover
Anbieter: Kennys Bookstore, Olney, MD, USAKennys Bookstore
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 250,00
EUR 9,19 VersandVersand innerhalb von USAAnzahl: Mehr als 20 verfügbar
Zustand: New. All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost--effective products should know that the paradigm has shifted. Editor(s): Pecht, Michael; Dasgupta, Abhijit; Evans, John W.; Evans, Jillian Y. Num Pages: 462 pages, Illustrations. BIC Classific…ation: KJMV5; TGPQ; TGPR; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 243 x 163 x 29. Weight in Grams: 888. . 1994. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.
- Softcover
Anbieter: AHA-BUCH GmbH, Einbeck, DeutschlandAHA-BUCH GmbH
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 223,21
EUR 63,73 VersandVersand von Deutschland nach USAAnzahl: 2 verfügbar
Taschenbuch. Zustand: Neu. Neuware - All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost-effective products should know that the paradigm has shifted. It has shifted away from the MIL-STDs and other government standards and test procedures that don't cost-eff…ectively address potential failure mechanisms or the manufacturing processes of the product. It has shifted decisively towards tackling the root causes of failure and the appropriate implementation of cost-effective process controls, qualityscreens, and tests.
- Softcover
- Erstausgabe
Anbieter: AussieBookSeller, Truganina, VIC, AustralienAussieBookSeller
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 284,73
EUR 32,38 VersandVersand von Australien nach USAAnzahl: 1 verfügbar
Paperback. Zustand: new. Paperback. All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectiv…ely address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful. * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate.wire and wire, tape automated,and flip-chip bonding.element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp. All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost--effective products should know that the paradigm has shifte Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
- Hardcover
Anbieter: Mispah books, Redhill, SURRE, Vereinigtes KönigreichMispah books
Verkäufer/-in kontaktierenVerkäufer/-in mit 4 SternenZustand: Gebraucht - Wie neu
EUR 321,21
EUR 28,98 VersandVersand von Vereinigtes Königreich nach USAAnzahl: 1 verfügbar
Hardcover. Zustand: Like New. Like New. book.
Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Pecht, Michael & Dasgupta, Abhijit & Evans, John W. & Evans, Jillian Y. (Eds. )
Verlag: John Wiley & Sons, New York 1994
- Hardcover
- Erstausgabe
Anbieter: Riverwash Books (IOBA), Prescott, ON, KanadaRiverwash Books (IOBA)
Verkäufer/-in kontaktierenVerkäufer/-in mit 4 SternenZustand: Gebraucht - Gut
EUR 90,14
EUR 16,63 VersandVersand von Kanada nach USAAnzahl: 1 verfügbar
Hardcover. Zustand: Very Good. Zustand des Schutzumschlags: Very Good. First Edition. 461 pp. Spine bumped. Jacket edges worn. Describes how to develop qualification and quality assurance programs to achieve high reliability in microelectronics. ; 8vo 8" - 9" tall.
Quality Conformance and Qualification of Microelec Microelectronic Packages & Interconnects
Pecht, Michael/ Dasgupta, Abhijit/ Evans, John W. (Contributor)
- Softcover
- Print-on-Demand
Anbieter: Revaluation Books, Exeter, , Vereinigtes KönigreichRevaluation Books
Verkäufer/-in kontaktierenVerkäufer/-in mit 5 SternenZustand: Neu
EUR 218,04
EUR 14,49 VersandVersand von Vereinigtes Königreich nach USAAnzahl: 2 verfügbar
Paperback. Zustand: Brand New. 461 pages. 9.75x6.75x1.25 inches. In Stock. This item is printed on demand.
