Sprache: Englisch
Verlag: The Institution of Engineering and Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
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Sprache: Englisch
Verlag: The Institution of Engineering and Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
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Sprache: Englisch
Verlag: The Institution of Engineering and Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
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Zustand: New.
Sprache: Englisch
Verlag: The Institution of Engineering and Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
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In den WarenkorbZustand: As New. Unread book in perfect condition.
Sprache: Englisch
Verlag: Institution of Engineering and Technology, GB, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
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Hardback. Zustand: New. High-frequency switching power semiconductor devices are at the heart of power electronic converters. To date, these devices have been dominated by the well-established silicon (Si) technology. However, their intrinsic physical limits are becoming a barrier to achieving higher performance power conversion. Wide Bandgap (WBG) semiconductor devices offer the potential for higher efficiency, smaller size, lighter weight, and/or longer lifetime. Applications in power grid electronics as well as in electromobility are on the rise, but a number of technological bottle-necks need to be overcome if applications are to become more widespread - particularly packaging. This book describes the development of advanced multi-chip packaging solutions for novel WBG semiconductors, specifically silicon carbide (SiC) power MOSFETs. Coverage includes an introduction; multi-chip power modules; module design and transfer to SiC technology; electrothermal, thermo-mechanical, statistical and electromagnetic aspects of optimum module design; high temperature capable SiC power modules; validation technologies; degradation monitoring; and emerging packaging technologies. The book is a valuable reference for researchers and experts in academia and industry.
Sprache: Englisch
Verlag: The Institution of Engineering and Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
Anbieter: Ria Christie Collections, Uxbridge, Vereinigtes Königreich
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Sprache: Englisch
Verlag: The Institution of Engineering and Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
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In den WarenkorbZustand: New.
Sprache: Englisch
Verlag: The Institution of Engineering and Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
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In den WarenkorbZustand: As New. Unread book in perfect condition.
Sprache: Englisch
Verlag: Institution of Engineering and Technology, GB, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
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In den WarenkorbHardback. Zustand: New. High-frequency switching power semiconductor devices are at the heart of power electronic converters. To date, these devices have been dominated by the well-established silicon (Si) technology. However, their intrinsic physical limits are becoming a barrier to achieving higher performance power conversion. Wide Bandgap (WBG) semiconductor devices offer the potential for higher efficiency, smaller size, lighter weight, and/or longer lifetime. Applications in power grid electronics as well as in electromobility are on the rise, but a number of technological bottle-necks need to be overcome if applications are to become more widespread - particularly packaging. This book describes the development of advanced multi-chip packaging solutions for novel WBG semiconductors, specifically silicon carbide (SiC) power MOSFETs. Coverage includes an introduction; multi-chip power modules; module design and transfer to SiC technology; electrothermal, thermo-mechanical, statistical and electromagnetic aspects of optimum module design; high temperature capable SiC power modules; validation technologies; degradation monitoring; and emerging packaging technologies. The book is a valuable reference for researchers and experts in academia and industry.
Sprache: Englisch
Verlag: Inst of Engineering & Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
Anbieter: Revaluation Books, Exeter, Vereinigtes Königreich
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In den WarenkorbHardcover. Zustand: Brand New. 300 pages. 9.25x6.00x0.75 inches. In Stock.
Sprache: Englisch
Verlag: INSTITUTION OF ENGINEERING & T, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
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In den WarenkorbZustand: New. KlappentextWide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packagin.
Sprache: Englisch
Verlag: Institution Of Engineering & Technology Feb 2022, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
Anbieter: AHA-BUCH GmbH, Einbeck, Deutschland
Buch. Zustand: Neu. Neuware - Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes.
Sprache: Englisch
Verlag: Institution of Engineering and Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
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In den WarenkorbHRD. Zustand: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
Sprache: Englisch
Verlag: Institution of Engineering and Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
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HRD. Zustand: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
Sprache: Englisch
Verlag: Institution of Engineering and Technology, 2022
ISBN 10: 1785619071 ISBN 13: 9781785619076
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In den WarenkorbHardback. Zustand: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.