simulation techniques solutions mixed signal (33 Ergebnisse)

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Paperback. Zustand: new. Paperback. The goal ofputting "systems on a chip" has been a difficultchallenge that is only recently beginning to be met. Since the world is "analog"putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir- cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig- ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign- ers who have to deal with the complexityofmixed-signal coupling is the lackofveri- fication techniques to simulate the problem.In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech- niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions. FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.

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Hardcover. Zustand: new. Hardcover. The goal of putting "systems on a chip" has been a difficult challenge that is only recently being met. Since the world is "analogue", putting systems on a chip requires putting analogue interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analogue and digital circuitry are being designed. Whether a small amount of analogue circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analogue and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem.This text addresses two major issues of the mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques and suggests possible solutions. Readers of this book should come away with a clear directive to simulate their design for interactions prior to building the design, versus a "build it and see" mentality. This text addresses two major issues of the mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques and suggests possible solutions. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.

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Zustand: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher.

Zustand: New. pp. xxiii + 280 Index.

Buch. Zustand: Neu. Neuware -FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 308 pp. Englisch.

Taschenbuch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The goal ofputting 'systems on a chip' has been a difficultchallenge that is only recently beginning to be met. Since the world is 'analog'putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign ers who have to deal with the complexityofmixed-signal coupling is the lackofveri fication techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions.

Zustand: New. This text addresses two major issues of the mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques and suggests possible solutions. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 280 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 235 x 155 x 22. Weight in Grams: 625. . 1994. Hardback. . . . .

Buch. Zustand: Neu. Druck auf Anfrage Neuware - Printed after ordering - The goal ofputting 'systems on a chip' has been a difficultchallenge that is only recently beginning to be met. Since the world is 'analog'putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign ers who have to deal with the complexityofmixed-signal coupling is the lackofveri fication techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions.

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Hardcover. Zustand: Brand New. 1995 edition. 304 pages. 9.75x6.50x0.75 inches. In Stock.

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Zustand: New. This text addresses two major issues of the mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques and suggests possible solutions. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 280 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 235 x 155 x 22. Weight in Grams: 625. . 1994. Hardback. . . . . Books ship from the US and Ireland.

Paperback. Zustand: new. Paperback. The goal ofputting "systems on a chip" has been a difficultchallenge that is only recently beginning to be met. Since the world is "analog"putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir- cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig- ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign- ers who have to deal with the complexityofmixed-signal coupling is the lackofveri- fication techniques to simulate the problem.In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech- niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions. FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.

Hardcover. Zustand: new. Hardcover. The goal of putting "systems on a chip" has been a difficult challenge that is only recently being met. Since the world is "analogue", putting systems on a chip requires putting analogue interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analogue and digital circuitry are being designed. Whether a small amount of analogue circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analogue and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem.This text addresses two major issues of the mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques and suggests possible solutions. Readers of this book should come away with a clear directive to simulate their design for interactions prior to building the design, versus a "build it and see" mentality. This text addresses two major issues of the mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques and suggests possible solutions. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.

Kluwer, Boston, 1995. XXII, 280 pages with some graphics, hardcover----former library book in good condition- 536 Gramm.

Taschenbuch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The goal ofputting 'systems on a chip' has been a difficultchallenge that is only recently beginning to be met. Since the world is 'analog'putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign ers who have to deal with the complexityofmixed-signal coupling is the lackofveri fication techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions. 308 pp. Englisch.

Buch. Zustand: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The goal ofputting 'systems on a chip' has been a difficultchallenge that is only recently beginning to be met. Since the world is 'analog'putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign ers who have to deal with the complexityofmixed-signal coupling is the lackofveri fication techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions. 308 pp. Englisch.

Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. List of Figures. List of Tables. Preface. 1. Introduction. 2. Sources of Noise and Methods of Coupling. 3. Semiconductor Device Simulation. 4. Simplified Substrate Modeling and Rapid Simulation. 5. Mesh Generation. 6. Substrate Modeling in Heavily-Doped.

Gebunden. Zustand: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. List of Figures. List of Tables. Preface. 1. Introduction. 2. Sources of Noise and Methods of Coupling. 3. Semiconductor Device Simulation. 4. Simplified Substrate Modeling and Rapid Simulation. 5. Mesh Generation. 6. Substrate Modeling in Heavily-Doped.